Inventor · disambiguated record
Kenichi Kawabata
Also filed as: KAWABATA KENICHI
101 granted patents·34 pending applications·1,918 citations·filing 1993–2023
99Inventor score
Top patents by PatentIndex Score
135 records- 0199US6216538B1Particle handling apparatus for handling particles in fluid by acoustic radiation pressureHITACHI LTD·Filed 1996·Granted Apr 17, 2001·301 cites·46 claims
- 0296US9972579B1Composite magnetic sealing material and electronic circuit package using the sameTDK CORP·Filed 2017·Granted May 15, 2018·14 cites·23 claims
- 0395US7868464B2Multilayer substrate and manufacturing method thereofTDK CORP·Filed 2005·Granted Jan 11, 2011·40 cites·23 claims
- 0494US5523058AUltrasonic irradiation apparatus and processing apparatus based thereonHITACHI LTD·Filed 1993·Granted Jun 4, 1996·435 cites·24 claims
- 0593US6572839B2Sensitizer for tumor treatmentHITACHI LTD·Filed 2001·Granted Jun 3, 2003·64 cites·8 claims
- 0692US7992953B2Image forming apparatus and method of correcting deviation of shooting positionRICOH CO LTD·Filed 2008·Granted Aug 9, 2011·14 cites·10 claims
- 0792US7496326B2Electrostatic attraction device and image forming apparatus using the sameRICOH KK·Filed 2005·Granted Feb 24, 2009·14 cites·17 claims
- 0891US7914096B2Image forming apparatus, landing position shift correction method, and landing position shift correction sheet memberRICOH CO LTD·Filed 2008·Granted Mar 29, 2011·13 cites·10 claims
- 0990US8026614B2Semiconductor IC-embedded substrate and method for manufacturing sameTDK CORP·Filed 2009·Granted Sep 27, 2011·17 cites·14 claims
- 1090US7775619B2Image forming apparatusRICOH KK·Filed 2006·Granted Aug 17, 2010·12 cites·22 claims
- 1190US6908960B2Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosettinTDK CORP·Filed 2000·Granted Jun 21, 2005·58 cites·32 claims
- 1289US10403582B2Electronic circuit package using composite magnetic sealing materialTDK CORP·Filed 2017·Granted Sep 3, 2019·5 cites·23 claims
- 1389US9953932B2Electronic circuit packageTDK CORP·Filed 2017·Granted Apr 24, 2018·7 cites·9 claims
- 1489US9881877B2Electronic circuit package using composite magnetic sealing materialTDK CORP·Filed 2016·Granted Jan 30, 2018·5 cites·19 claims
- 1589US7841682B2Image forming apparatus and landing position error correction methodRICOH CO LTD·Filed 2009·Granted Nov 30, 2010·11 cites·12 claims
- 1689US7247590B2Composite dielectric, composite dielectric sheet, composite dielectric paste, metal-layered composite dielectric, wiring board and multilayer wiring boardTDK CORP·Filed 2004·Granted Jul 24, 2007·30 cites·14 claims
- 1788US10269727B2Composite magnetic sealing material and electronic circuit package using the same as mold materialTDK CORP·Filed 2018·Granted Apr 23, 2019·4 cites·21 claims
- 1888US10256194B2Electronic circuit package using composite magnetic sealing materialTDK CORP·Filed 2017·Granted Apr 9, 2019·4 cites·11 claims
- 1987US9818518B2Composite magnetic sealing materialTDK CORP·Filed 2016·Granted Nov 14, 2017·4 cites·14 claims
- 2087US7854489B2Image forming apparatusRICOH CO LTD·Filed 2009·Granted Dec 21, 2010·9 cites·8 claims
- 2186US10448546B1Noise suppression sheetTDK CORP·Filed 2018·Granted Oct 15, 2019·2 cites·4 claims
- 2286US10170431B2Electronic circuit packageTDK CORP·Filed 2016·Granted Jan 1, 2019·5 cites·8 claims
- 2384US5435311AUltrasound therapeutic systemHITACHI LTD·Filed 1994·Granted Jul 25, 1995·309 cites·3 claims
- 2483US10959706B2Phantom for ultrasound measurement, and ultrasound CT deviceHITACHI LTD·Filed 2018·Granted Mar 30, 2021·5 cites·13 claims
- 2583US10242954B2Electronic circuit package having high composite shielding effectTDK CORP·Filed 2016·Granted Mar 26, 2019·4 cites·18 claims
- 2683US9966343B2Electronic circuit packageTDK CORP·Filed 2017·Granted May 8, 2018·4 cites·11 claims
- 2783US9907179B2Electronic circuit packageTDK CORP·Filed 2016·Granted Feb 27, 2018·4 cites·13 claims
- 2883US8042904B2Image forming apparatus and carriageRICOH CO LTD·Filed 2008·Granted Oct 25, 2011·7 cites·11 claims
- 2983US7544537B2Semiconductor IC-embedded substrate and method for manufacturing sameTDK CORP·Filed 2006·Granted Jun 9, 2009·9 cites·11 claims
- 3081US8186799B2Image forming apparatus and impact position displacement correction methodMORINO TETSU·Filed 2008·Granted May 29, 2012·6 cites·11 claims
- 3181US7733600B2Hard disk drive and wireless data terminal using the sameTDK CORP·Filed 2006·Granted Jun 8, 2010·10 cites·21 claims
- 3280US8742589B2Semiconductor embedded module and method for producing the sameKAWABATA KENICHI·Filed 2009·Granted Jun 3, 2014·9 cites·7 claims
- 3380US6511428B1Ultrasonic medical treating deviceHITACHI LTD·Filed 1999·Granted Jan 28, 2003·270 cites·9 claims
- 3479US7758180B2Image forming apparatus including an electrostatic conveyance apparatus capable of stably conveying a recording mediumRICOH KK·Filed 2006·Granted Jul 20, 2010·5 cites·19 claims
- 3578US8911372B2Ultrasonic medical diagnostic device for imaging changes with timeHITACHI MEDICAL CORP·Filed 2013·Granted Dec 16, 2014·8 cites·6 claims
- 3677US7761982B2Method for manufacturing IC-embedded substrateTDK CORP·Filed 2006·Granted Jul 27, 2010·7 cites·9 claims
- 3776US10362686B2Lead-free solder and electronic component built-in moduleTDK CORP·Filed 2015·Granted Jul 23, 2019·2 cites·2 claims
- 3876US9439288B2Mounting structure of chip component and electronic module using the sameTDK CORP·Filed 2013·Granted Sep 6, 2016·3 cites·17 claims
- 3975US8492659B2Printed wiring board and manufacturing method thereforNAGASE KENJI·Filed 2009·Granted Jul 23, 2013·7 cites·6 claims
- 4075US7074427B2Medicine, carrier for medicine, method of producing medicine, and method of tumor treatmentHITACHI LTD·Filed 2002·Granted Jul 11, 2006·4 cites·3 claims
- 4174US11765874B2Metal magnetic film and magnetic sheetTDK CORP·Filed 2020·Granted Sep 19, 2023·0 cites·10 claims
- 4274US8157342B2Liquid-jet device, image forming apparatus, and method for adjusting landing positions of liquid dropletsMORINO TETSU·Filed 2008·Granted Apr 17, 2012·4 cites·19 claims
- 4374US8066348B2Image forming apparatus and defective nozzle detection methodHIROTA TETSURO·Filed 2008·Granted Nov 29, 2011·4 cites·18 claims
- 4473US10799217B2Ultrasound imaging device and ultrasound image generation programHITACHI LTD·Filed 2018·Granted Oct 13, 2020·2 cites·11 claims
- 4573US8303752B2Method of manufacturing wiring boardKAWABATA KENICHI·Filed 2009·Granted Nov 6, 2012·2 cites·4 claims
- 4671US8822837B2Wiring board, electronic component embedded substrate, method of manufacturing wiring board, and method of manufacturing electronic component embedded substrateUEMATSU HIROYUKI·Filed 2011·Granted Sep 2, 2014·3 cites·10 claims
- 4770US7125387B2Ultrasonic apparatus for therapeutical useHITACHI LTD·Filed 2003·Granted Oct 24, 2006·45 cites·15 claims
- 4869US8502081B2Assembly substrate and method of manufacturing the sameKANEMARU YOSHIKAZU·Filed 2008·Granted Aug 6, 2013·6 cites·5 claims
- 4968US9381595B2Pb-free solder and electronic component built-in moduleTDK CORP·Filed 2015·Granted Jul 5, 2016·1 cites·4 claims
- 5068US7824336B2Ultrasonic apparatus for diagnosis and therapyHITACHI LTD·Filed 2006·Granted Nov 2, 2010·8 cites·5 claims
Showing the top 50 of 135 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →