Inventor · disambiguated record
Keizo Kawamura
Also filed as: KAWAMURA KEIZO
10 granted patents·223 citations·filing 1986–2021
87Inventor score
Top patents by PatentIndex Score
10 records- 0190US4770242ACooling device of semiconductor chipsHITACHI LTD·Filed 1986·Granted Sep 13, 1988·96 cites·4 claims
- 0286US5774334ALow thermal resistant, fluid-cooled semiconductor moduleHITACHI LTD·Filed 1995·Granted Jun 30, 1998·89 cites·15 claims
- 0378US11626235B2Coil component and electronic deviceTAIYO YUDEN KK·Filed 2018·Granted Apr 11, 2023·1 cites·6 claims
- 0475US11532427B2Coil component and electronic deviceTAIYO YUDEN KK·Filed 2021·Granted Dec 20, 2022·0 cites·15 claims
- 0568US11139105B2Coil component and electronic deviceTAIYO YUDEN KK·Filed 2018·Granted Oct 5, 2021·0 cites·15 claims
- 0667USRE35721ECooling device of semiconductor chipsHITACHI LTD·Filed 1989·Granted Feb 3, 1998·33 cites·4 claims
- 0761US9984811B2Electronic componentTAIYO YUDEN KK·Filed 2016·Granted May 29, 2018·0 cites·10 claims
- 0860US9460843B2Electronic componentTAIYO YUDEN KK·Filed 2014·Granted Oct 4, 2016·0 cites·10 claims
- 0957US6280829B1Ceramic composition for use in forming electronic componentsTAIYO YUDEN KK·Filed 2000·Granted Aug 28, 2001·4 cites·6 claims
- 1036US7176154B2Ceramic composition and ceramic wiring boardTAIYO YUDEN KK·Filed 2004·Granted Feb 13, 2007·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →