Inventor · disambiguated record
Kenichi Kawasaki
Also filed as: KAWASAKI KEN ICHI · KAWASAKI KENICHI
143 granted patents·18 pending applications·1,563 citations·filing 1993–2022
99Inventor score
Top patents by PatentIndex Score
161 records- 0198US7907924B2Semiconductor device interconnecting unit, semiconductor device and high-frequency module having a millimeter wave bandSONY CORP·Filed 2007·Granted Mar 15, 2011·81 cites·3 claims
- 0297US7760045B2Semiconductor device interconnecting unit, semiconductor device, high-frequency module, and semiconductor device interconnecting methodSONY CORP·Filed 2007·Granted Jul 20, 2010·74 cites·5 claims
- 0396US11719788B2Signal processing apparatus, signal processing method, and programSONY CORP·Filed 2020·Granted Aug 8, 2023·4 cites·18 claims
- 0495US8149566B2Laminated electronic component and manufacturing method thereforMOTOKI AKIHIRO·Filed 2010·Granted Apr 3, 2012·18 cites·8 claims
- 0594US8184424B2Multilayer electronic component including a counter diffusion layerMOTOKI AKIHIRO·Filed 2008·Granted May 22, 2012·12 cites·3 claims
- 0694US7933113B2Multilayer electronic component and method for manufacturing multilayer electronic componentMURATA MANUFACTURING CO·Filed 2008·Granted Apr 26, 2011·30 cites·2 claims
- 0794US7123243B2Touch panel integrated type display apparatusPIONEER CORP·Filed 2003·Granted Oct 17, 2006·112 cites·7 claims
- 0894US7071629B2Image display device incorporating driver circuits on active substrate and other methods to reduce interconnectsSONY ELECTRONICS INC·Filed 2003·Granted Jul 4, 2006·68 cites·31 claims
- 0993US8587923B2Laminated electronic component including water repellant and manufacturing method thereforOGAWA MAKOTO·Filed 2010·Granted Nov 19, 2013·15 cites·6 claims
- 1093US8320101B2Multilayer electronic component and method for manufacturing the sameTAKEUCHI SHUNSUKE·Filed 2010·Granted Nov 27, 2012·7 cites·2 claims
- 1191US7761092B2Systems and methods for communicating with multiple devicesSONY CORP·Filed 2004·Granted Jul 20, 2010·78 cites·8 claims
- 1291US6594770B1Semiconductor integrated circuit deviceFUJITSU LTD·Filed 1999·Granted Jul 15, 2003·90 cites·15 claims
- 1390US9418790B2Method for manufacturing a multilayer ceramic electronic componentTAKEUCHI SHUNSUKE·Filed 2012·Granted Aug 16, 2016·7 cites·2 claims
- 1490US8631549B2Method for manufacturing multilayer electronic componentMOTOKI AKIHIRO·Filed 2011·Granted Jan 21, 2014·8 cites·6 claims
- 1590US7120761B2Multi-port memory based on DRAM coreFUJITSU LTD·Filed 2002·Granted Oct 10, 2006·38 cites·41 claims
- 1690US7110755B2Information processing system, information processing method of information processing system, information processing apparatus, and information processing programPIONEER CORP·Filed 2002·Granted Sep 19, 2006·66 cites·39 claims
- 1789US8125763B2Multilayer ceramic electronic component and method for making the sameKOBAYASHI TATSUNORI·Filed 2009·Granted Feb 28, 2012·23 cites·8 claims
- 1888US9608683B2Millimeter wave transmission device, millimeter wave transmission method, and millimeter wave transmission systemSONY CORP·Filed 2014·Granted Mar 28, 2017·7 cites·19 claims
- 1988US9244515B2Semiconductor device comprising delay monitor and discrete supply switchesFUJITSU LTD·Filed 2013·Granted Jan 26, 2016·11 cites·10 claims
- 2088US8890362B2Semiconductor deviceKAWASAKI KENICHI·Filed 2011·Granted Nov 18, 2014·9 cites·14 claims
- 2188US8130485B2Ceramic electronic component and method for manufacturing the sameOGAWA MAKOTO·Filed 2009·Granted Mar 6, 2012·5 cites·7 claims
- 2287US9544007B2Wireless transmission system, wireless communication device, and wireless communication methodSONY CORP·Filed 2016·Granted Jan 10, 2017·4 cites·24 claims
- 2387US9281860B2Wireless transmission system, wireless communication device, and wireless communication methodKAWASAKI KENICHI·Filed 2014·Granted Mar 8, 2016·6 cites·24 claims
- 2487US8575952B2Semiconductor device and test methodKAWASAKI KENICHI·Filed 2010·Granted Nov 5, 2013·9 cites·6 claims
- 2587US7715171B2Multilayer ceramic capacitorMURATA MANUFACTURING CO·Filed 2008·Granted May 11, 2010·18 cites·18 claims
- 2687US5955904ASemiconductor integrated circuit with appropriate data output timing and reduced power consumptionFUJITSU LTD·Filed 1997·Granted Sep 21, 1999·69 cites·14 claims
- 2787US5909142ASemiconductor integrated circuit device having burn-in test capability and method for using the sameFUJITSU LTD·Filed 1997·Granted Jun 1, 1999·47 cites·39 claims
- 2886US11119203B2Radar device, signal processor, and signal processing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2017·Granted Sep 14, 2021·5 cites·8 claims
- 2986US9704649B2Method for producing ceramic electronic componentSAITO JUNICHI·Filed 2011·Granted Jul 11, 2017·3 cites·4 claims
- 3085US10908257B2Signal processing apparatus, signal processing method, and programSONY CORP·Filed 2016·Granted Feb 2, 2021·5 cites·18 claims
- 3185US7764484B2Multilayer electronic component and method for manufacturing the sameMURATA MANUFACTURING CO·Filed 2008·Granted Jul 27, 2010·11 cites·2 claims
- 3285US7715172B2Multilayer capacitorMURATA MANUFACTURING CO·Filed 2008·Granted May 11, 2010·16 cites·20 claims
- 3384US8718544B2Signal transmission device, electronic device, and signal transmission methodKAWASAKI KENICHI·Filed 2010·Granted May 6, 2014·7 cites·15 claims
- 3484US8520361B2Laminated electronic componentMOTOKI AKIHIRO·Filed 2011·Granted Aug 27, 2013·5 cites·3 claims
- 3584US8484815B2Method for manufacturing laminated electronic componentTAKEUCHI SHUNSUKE·Filed 2011·Granted Jul 16, 2013·4 cites·3 claims
- 3684US7965837B2Method and system for wireless digital video presentationSONY CORP·Filed 2003·Granted Jun 21, 2011·25 cites·25 claims
- 3783US10942268B2MIMO radar device and vehicleSONY CORP·Filed 2017·Granted Mar 9, 2021·4 cites·13 claims
- 3883US7188793B2Electronic circuit device for fishing equipmentSHIMANO KK·Filed 2004·Granted Mar 13, 2007·23 cites·31 claims
- 3982US9287903B2Signal transmission apparatus, electronic instrument and signal transmission methodTAKEDA TAKAHIRO·Filed 2011·Granted Mar 15, 2016·6 cites·22 claims
- 4082US8547683B2Laminated ceramic electronic component with directly plated external terminal electrodes and manufacturing method thereforSARUBAN MASAHITO·Filed 2010·Granted Oct 1, 2013·5 cites·2 claims
- 4182US6298004B1Semiconductor device, semiconductor system, and digital delay circuitFUJITSU LTD·Filed 1997·Granted Oct 2, 2001·36 cites·83 claims
- 4282US6066969ASemiconductor device with DLL circuit avoiding excessive power consumptionFUJITSU LTD·Filed 1998·Granted May 23, 2000·50 cites·10 claims
- 4381US7860473B2Systems and methods for providing millimeter wave signal improvementsSONY CORP·Filed 2006·Granted Dec 28, 2010·8 cites·20 claims
- 4481US7596367B2System and method for standby mode in directional signal receiverSONY CORP·Filed 2005·Granted Sep 29, 2009·9 cites·7 claims
- 4581US6522182B2Integrated circuit device incorporating DLL circuitFUJITSU LTD·Filed 1999·Granted Feb 18, 2003·41 cites·30 claims
- 4681US6498524B1Input/output data synchronizing deviceFUJITSU LTD·Filed 2000·Granted Dec 24, 2002·20 cites·1 claims
- 4780US8804303B2Multilayer electronic component and method for manufacturing the sameMOTOKI AKIHIRO·Filed 2012·Granted Aug 12, 2014·2 cites·3 claims
- 4880US8240016B2Method for manufacturing multilayer electronic componentMOTOKI AKIHIRO·Filed 2010·Granted Aug 14, 2012·5 cites·6 claims
- 4979US11909122B2Moving object mounted radar antenna, module for moving object mounted radar antenna, and moving object mounted radar antenna systemSONY GROUP CORP·Filed 2020·Granted Feb 20, 2024·1 cites·19 claims
- 5079US7902914B2Semiconductor integrated circuitFUJITSU LTD·Filed 2009·Granted Mar 8, 2011·9 cites·11 claims
Showing the top 50 of 161 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →