Inventor · disambiguated record
Keita Kitazawa
Also filed as: KITAZAWA KEITA
14 granted patents·5 pending applications·8 citations·filing 2014–2023
84Inventor score
Files withSHINETSU CHEMICAL CO19
Top patents by PatentIndex Score
19 records- 0189US11912869B2Non-curable thermal-conductive silicone compositionSHINETSU CHEMICAL CO·Filed 2020·Granted Feb 27, 2024·2 cites·8 claims
- 0288US12221543B2Thermally conductive silicone composition and production method thereforSHINETSU CHEMICAL CO·Filed 2020·Granted Feb 11, 2025·2 cites·6 claims
- 0384US12180368B2Thermal-conductive silicone composition, production method therefor, and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2020·Granted Dec 31, 2024·2 cites·18 claims
- 0474US11041072B2One-pack addition curable silicone composition, method for storing same, and method for curing sameSHINETSU CHEMICAL CO·Filed 2019·Granted Jun 22, 2021·0 cites·3 claims
- 0570US2025376592A1Curable silicone composition, method for manufacturing and curing same, silicone cured product and method for manufacturing same, and [2+2+2] cycloaddition reaction product and method for manufacturing sameSHINETSU CHEMICAL CO·Filed 2023·Application pending·0 cites
- 0669US9394470B2Silicone compositionSHINETSU CHEMICAL CO·Filed 2015·Granted Jul 19, 2016·2 cites·20 claims
- 0768US2023124814A1Thermal conductive silicone compositionSHINETSU CHEMICAL CO·Filed 2022·Application pending·0 cites
- 0867US10202529B2Silicone composition and method for manufacturing heat-conductive silicone compositionSHINETSU CHEMICAL CO·Filed 2017·Granted Feb 12, 2019·0 cites·4 claims
- 0963US9969919B2Silicone composition and method for manufacturing heat-conductive silicone compositionSHINETSU CHEMICAL CO·Filed 2014·Granted May 15, 2018·0 cites·1 claims
- 1058US2017260392A1One-pack addition curable silicone composition, method for storing same, and method for curing sameSHINETSU CHEMICAL CO·Filed 2015·Application pending·0 cites
- 1155US9840594B2Organopolysiloxane compound and method for producing the same, and addition-curable silicone compositionSHINETSU CHEMICAL CO·Filed 2014·Granted Dec 12, 2017·0 cites·11 claims
- 1255US2025171673A1Thermal conductive addition-curable silicone composition and cured product thereofSHINETSU CHEMICAL CO·Filed 2023·Application pending·0 cites
- 1352US11591470B2Silicone compositionSHINETSU CHEMICAL CO·Filed 2019·Granted Feb 28, 2023·0 cites·5 claims
- 1450US10023741B2Heat-conductive silicone compositionSHINETSU CHEMICAL CO·Filed 2014·Granted Jul 17, 2018·0 cites·2 claims
- 1549US2021388207A1Addition curing silicone composition and method for manufacturing sameSHINETSU CHEMICAL CO·Filed 2019·Application pending·0 cites
- 1648US11028234B2Addition-curable silicone compositionSHINETSU CHEMICAL CO·Filed 2018·Granted Jun 8, 2021·0 cites·4 claims
- 1747US11041064B2Addition-cure silicone compositionSHINETSU CHEMICAL CO·Filed 2018·Granted Jun 22, 2021·0 cites·5 claims
- 1844US12391860B2Thermal-conductive silicone compositionSHINETSU CHEMICAL CO·Filed 2020·Granted Aug 19, 2025·0 cites·8 claims
- 1934US10689515B2Silicone composition based on both condensation/curing reaction and organic-peroxide curing reactionSHINETSU CHEMICAL CO·Filed 2016·Granted Jun 23, 2020·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →