Inventor · disambiguated record

Kean Ming Koe

Also filed as: KOE KEAN MING

2 granted patents·1 pending application·6 citations·filing 2021–2023

51Inventor score

Technology areasH10W

Files withINFINEON TECHNOLOGIES AG3

Top patents by PatentIndex Score

3 records

0190US11652078B2High voltage semiconductor package with pin fit leadsINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 16, 2023·3 cites·17 claims
0287US11621204B2Molded semiconductor module having a mold step for increasing creepage distanceINFINEON TECHNOLOGIES AG·Filed 2021·Granted Apr 4, 2023·3 cites·22 claims
0352US2024087992A1Chip package, chip system, method of forming a chip package, and method of forming a chip systemINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →