Inventor · disambiguated record
Kenji Kubota
Also filed as: KUBOTA KENJI
56 granted patents·11 pending applications·700 citations·filing 1984–2024
98Inventor score
Files withMITSUBISHI MATERIALS CORP29MURATA MANUFACTURING CO12MAZDA MOTOR6HITACHI LTD2JVC KENWOOD CORP2
Top patents by PatentIndex Score
67 records- 0188US8940404B2Tin-plated copper-alloy material for terminal and method for producing the sameMITSUBISHI MATERIALS CORP·Filed 2013·Granted Jan 27, 2015·5 cites·3 claims
- 0285US5635670AMultilayer electronic componentMURATA MANUFACTURING CO·Filed 1996·Granted Jun 3, 1997·59 cites·16 claims
- 0385US5488765AMethod of measuring characteristics of a multilayer electronic componentMURATA MANUFACTURING CO·Filed 1994·Granted Feb 6, 1996·65 cites·4 claims
- 0485US4641249AMethod and device for compensating temperature-dependent characteristic changes in ion-sensitive FET transducerKURARAY CO·Filed 1984·Granted Feb 3, 1987·50 cites·9 claims
- 0584US10858750B2Tin-plated copper terminal material, terminal and electric wire terminal-end structureMITSUBISHI MATERIALS CORP·Filed 2018·Granted Dec 8, 2020·1 cites·20 claims
- 0683US8981233B2Conductive member and method for producing the sameMITSUBISHI SHINDO KK·Filed 2014·Granted Mar 17, 2015·2 cites·4 claims
- 0782US8339518B2Video signal processing method and apparatus using histogramKIDA SHINGO·Filed 2010·Granted Dec 25, 2012·5 cites·14 claims
- 0880US5644107AMethod of manufacturing a multilayer electronic componentMURATA MANUFACTURING CO·Filed 1995·Granted Jul 1, 1997·44 cites·6 claims
- 0979US5635669AMultilayer electronic componentMURATA MANUFACTURING CO·Filed 1995·Granted Jun 3, 1997·59 cites·13 claims
- 1077US6507139B1Apparatus having an electronic component located on a surface of a package member with a space therebetweenMURATA MANUFACTURING CO·Filed 1998·Granted Jan 14, 2003·28 cites·12 claims
- 1176US10407785B2Additive for high-purity copper electrolytic refining and method of producing high-purity copperMITSUBISHI MATERIALS CORP·Filed 2015·Granted Sep 10, 2019·1 cites·16 claims
- 1276US7400321B2Image display unitVICTOR COMPANY OF JAPAN·Filed 2004·Granted Jul 15, 2008·14 cites·2 claims
- 1376US5625935AMethod of manufacturing a multilayer electronic componentMURATA MANUFACTURING CO·Filed 1994·Granted May 6, 1997·40 cites·7 claims
- 1476US5493769AMethod of manufacturing electronic component and measuring characteristics of sameMURATA MANUFACTURING CO·Filed 1994·Granted Feb 27, 1996·53 cites·8 claims
- 1575US5604328AMultilayer electronic componentMURATA MANUFACTURING CO·Filed 1995·Granted Feb 18, 1997·33 cites·15 claims
- 1674US10280347B2Semiconductor device manufacturing method and underfill filmDEXERIALS CORP·Filed 2016·Granted May 7, 2019·2 cites·20 claims
- 1771US11753733B2Method for producing high-purity electrolytic copperMITSUBISHI MATERIALS CORP·Filed 2018·Granted Sep 12, 2023·0 cites·8 claims
- 1871US7782403B2Noise detection apparatus and method, and noise reduction apparatus and methodVICTOR COMPANY OF JAPAN·Filed 2006·Granted Aug 24, 2010·3 cites·4 claims
- 1969US8698002B2Conductive member and method for producing the sameSAKURAI TAKESHI·Filed 2009·Granted Apr 15, 2014·0 cites·3 claims
- 2068US2025024610A1Bonded body and insulating circuit boardMITSUBISHI MATERIALS CORP·Filed 2024·Application pending·0 cites
- 2167US11453953B2High-purity electrolytic copperMITSUBISHI MATERIALS CORP·Filed 2018·Granted Sep 27, 2022·0 cites·8 claims
- 2266US5335327AExternal memory control techniques with multiprocessors improving the throughput of data between a hierarchically upper processing unit and an external memory with efficient use of a cache memoryHITACHI LTD·Filed 1993·Granted Aug 2, 1994·44 cites·9 claims
- 2365US11781234B2Copper alloy plate, plating film-attached copper alloy plate, and methods respectively for manufacturing these productsMITSUBISHI MATERIALS CORP·Filed 2019·Granted Oct 10, 2023·0 cites·8 claims
- 2465US6277209B1Method and apparatus of regenerating filtration membrane cartridge for activated sludgeKUBOTA KK·Filed 1999·Granted Aug 21, 2001·32 cites·4 claims
- 2564US6871388B2Method of forming an electronic component located on a surface of a package member with a space therebetweenMURATA MANUFACTURING CO·Filed 2002·Granted Mar 29, 2005·8 cites·8 claims
- 2664US5952977AGlass antennaMAZDA MOTOR·Filed 1995·Granted Sep 14, 1999·33 cites·28 claims
- 2763US11901659B2Terminal material for connectorsMITSUBISHI MATERIALS CORP·Filed 2020·Granted Feb 13, 2024·0 cites·18 claims
- 2863US11761109B2Terminal material for connectorMITSUBISHI MATERIALS CORP·Filed 2021·Granted Sep 19, 2023·0 cites·4 claims
- 2963US11264750B2Tin-plated copper terminal material, terminal, and electric-wire terminal structureMITSUBISHI MATERIALS CORP·Filed 2018·Granted Mar 1, 2022·0 cites·10 claims
- 3063US8063861B2Image display unitAIBA HIDEKI·Filed 2008·Granted Nov 22, 2011·1 cites·2 claims
- 3161US11530490B2Terminal material with silver coating film and terminal with silver coating filmMITSUBISHI MATERIALS CORP·Filed 2018·Granted Dec 20, 2022·0 cites·12 claims
- 3260US8381997B2Radio frequency IC device and method of manufacturing the sameMURATA MANUFACTURING CO·Filed 2011·Granted Feb 26, 2013·1 cites·9 claims
- 3360US2024396242A1Terminal material with plating film and copper sheet for terminal materialMITSUBISHI MATERIALS CORP·Filed 2022·Application pending·0 cites
- 3459US12137526B2Bonded body and insulating circuit boardMITSUBISHI MATERIALS CORP·Filed 2021·Granted Nov 5, 2024·0 cites·4 claims
- 3558US11661667B2Anti-corrosion terminal material, anti-corrosion terminal and electric wire end structureMITSUBISHI MATERIALS CORP·Filed 2018·Granted May 30, 2023·0 cites·19 claims
- 3658US11088472B2Tin-plated copper terminal material, terminal, and wire terminal part structureMITSUBISHI MATERIALS CORP·Filed 2016·Granted Aug 10, 2021·0 cites·6 claims
- 3758US10801115B2Tinned copper terminal material, terminal, and electrical wire end part structureMITSUBISHI MATERIALS CORP·Filed 2017·Granted Oct 13, 2020·0 cites·8 claims
- 3858US6861588B2Laminated ceramic electronic component and method of producing the sameMURATA MANUFACTURING CO·Filed 2003·Granted Mar 1, 2005·8 cites·12 claims
- 3958US6002373AGlass window antennaMAZDA MOTOR·Filed 1997·Granted Dec 14, 1999·25 cites·48 claims
- 4057US8027120B2Magnetic tape device and data recording methodNEC CORP·Filed 2008·Granted Sep 27, 2011·0 cites·16 claims
- 4157US5659324AGlass antenna and method of designing the sameMAZDA MOTOR·Filed 1994·Granted Aug 19, 1997·24 cites·57 claims
- 4255US2023257897A1Corrosion-resistant terminal material for aluminum core wire, method for manufacturing same, corrosion-resistant terminal, and electric wire terminal structureMITSUBISHI MATERIALS CORP·Filed 2021·Application pending·0 cites
- 4354US10358730B2Additive for high-purity copper electrolytic refining and method of producing high-purity copperMITSUBISHI MATERIALS CORP·Filed 2015·Granted Jul 23, 2019·0 cites·14 claims
- 4453US2023299548A1Terminal material for connectorMITSUBISHI MATERIALS CORP·Filed 2021·Application pending·0 cites
- 4551US11211729B2Terminal material for connectors, terminal, and electric wire termination structureMITSUBISHI MATERIALS CORP·Filed 2018·Granted Dec 28, 2021·0 cites·7 claims
- 4651US8363166B2Image quality improving device and methodJVC KENWOOD CORP·Filed 2009·Granted Jan 29, 2013·0 cites·24 claims
- 4751US4774755AMagnetic head and process for producing sameSANYO ELECTRIC CO·Filed 1987·Granted Oct 4, 1988·7 cites·1 claims
- 4850US10428434B2Additive for high-purity copper electrolytic refining, method of producing high-purity copper, and high-purity electrolytic copperMITSUBISHI MATERIALS CORP·Filed 2016·Granted Oct 1, 2019·0 cites·13 claims
- 4950US2014004373A1Tin-plated copper-alloy material for terminal and method for producing the sameMITSUBISHI MATERIALS CORP·Filed 2013·Application pending·0 cites
- 5049US10793956B2Additive for high-purity copper electrolytic refining and method of producing high-purity copperMITSUBISHI MATERIALS CORP·Filed 2016·Granted Oct 6, 2020·0 cites·16 claims
Showing the top 50 of 67 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →