Inventor · disambiguated record
Kentaro Kubota
Also filed as: KUBOTA KENTARO
5 granted patents·5 pending applications·7 citations·filing 2004–2021
69Inventor score
Files withDSM IP ASSETS BV3KANSAI PAINT CO LTD3KUBOTA KENTARO2SHARP FUKUYAMA SEMICONDUCTOR CO LTD1TOPPAN PRINTING CO LTD1
Top patents by PatentIndex Score
10 records- 0180US9478674B2Method of manufacturing a circuit board by punchingDSM IP ASSETS BV·Filed 2013·Granted Oct 25, 2016·4 cites·4 claims
- 0266US9115440B2Method for forming multilayer coating film and coated articleKUBOTA KENTARO·Filed 2008·Granted Aug 25, 2015·3 cites·6 claims
- 0362US10651320B2Method of manufacturing a circuit board by punchingDSM IP ASSETS BV·Filed 2019·Granted May 12, 2020·0 cites·20 claims
- 0451US2009169903A1Process for producing metal substrate with multilayer film, metal substrate with multilayer film obtained by the process, and coated articleKANSAI PAINT CO LTD·Filed 2008·Application pending·0 cites
- 0549US10212810B2Printed wiring board and method of producing the sameTOPPAN PRINTING CO LTD·Filed 2017·Granted Feb 19, 2019·0 cites·10 claims
- 0649US8702954B2Manufacturing method for surface-treated metallic substrate and surface-treated metallic substrate obtained by said manufacturing method, and metallic substrate treatment method and metallic substrate treated by said methodKUBOTA KENTARO·Filed 2008·Granted Apr 22, 2014·0 cites·4 claims
- 0747US2008028976A1Electroplated Coating of Zinc Alloy with Excellent Corrosion Resistance and Plated Metal Material Having SameKANSAI PAINT CO LTD·Filed 2004·Application pending·0 cites
- 0845US2007170067A1Electroplating solution composition for organic polymer-zinc alloy composite plating and plated metal material using such compositionKANSAI PAINT CO LTD·Filed 2004·Application pending·0 cites
- 0945US2017018660A1Method of manufacturing a circuit board by punchingDSM IP ASSETS BV·Filed 2016·Application pending·0 cites
- 1044US2022123179A1Semiconductor moduleSHARP FUKUYAMA SEMICONDUCTOR CO LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →