Inventor · disambiguated record
Kenichi Kurihara
Also filed as: KURIHARA KENICHI
31 granted patents·18 pending applications·421 citations·filing 1988–2023
96Inventor score
Top patents by PatentIndex Score
49 records- 0194US5048179AIC chip mounting methodRICOH KK·Filed 1990·Granted Sep 17, 1991·236 cites·17 claims
- 0293US7736741B2Single-wall carbon nanotube heterojunctionSONY CORP·Filed 2007·Granted Jun 15, 2010·36 cites·6 claims
- 0392US10836183B2Recording device and recording systemSONY CORP·Filed 2017·Granted Nov 17, 2020·5 cites·18 claims
- 0486US11386588B2Product design system and design image correction apparatusSONY CORP·Filed 2017·Granted Jul 12, 2022·6 cites·7 claims
- 0583US7983908B2Noise-canceling device for voice communication terminal using configurable multiple digital filtersOKI ELECTRIC IND CO LTD·Filed 2007·Granted Jul 19, 2011·12 cites·7 claims
- 0675US8058736B2Semiconductor device having heat spreader with center openingKOIKE MASAHIRO·Filed 2007·Granted Nov 15, 2011·7 cites·19 claims
- 0771US10303684B1Resource scoring adjustment based on entity selectionsGOOGLE LLC·Filed 2013·Granted May 28, 2019·3 cites·17 claims
- 0869US2021162792A1Optical apparatus, rendering and erasing apparatus, and irradiation methodSONY CORP·Filed 2021·Application pending·0 cites
- 0968US7560415B2Reversible multicolor recording medium and recording method using itSONY CORP·Filed 2003·Granted Jul 14, 2009·6 cites·7 claims
- 1067US6995116B2Reversible multicolor recording medium, and recording method using the sameSONY CORP·Filed 2003·Granted Feb 7, 2006·6 cites·10 claims
- 1164US11865853B2Thermosensitive recording medium and exterior memberSONY CORP·Filed 2019·Granted Jan 9, 2024·0 cites·13 claims
- 1264US11518101B2Three-dimensional structure and method of manufacturing three-dimensional structureSONY CORP·Filed 2018·Granted Dec 6, 2022·0 cites·15 claims
- 1364US2025229560A1Drawing object and method of forming drawing objectSONY GROUP CORP·Filed 2023·Application pending·0 cites
- 1463US11104109B2Reversible recording medium and exterior memberSONY CORP·Filed 2017·Granted Aug 31, 2021·0 cites·20 claims
- 1563US5703396APlastic encapsulated semiconductor device having wing leadsNEC CORP·Filed 1996·Granted Dec 30, 1997·31 cites·5 claims
- 1662US12466196B2Drawing system and drawing methodSONY GROUP CORP·Filed 2022·Granted Nov 11, 2025·0 cites·12 claims
- 1762US11413878B2Drawing method, erasing method, and drawing apparatusSONY CORP·Filed 2019·Granted Aug 16, 2022·0 cites·20 claims
- 1862US10919329B2Optical apparatus, rendering and erasing apparatus, and irradiation methodSONY CORP·Filed 2018·Granted Feb 16, 2021·0 cites·9 claims
- 1962US2025367958A1Recording body and articleSONY GROUP CORP·Filed 2023·Application pending·0 cites
- 2060US11221112B2LED illumination device having light reflecting and transmitting memberABRAM CORP·Filed 2017·Granted Jan 11, 2022·1 cites·3 claims
- 2160US8029628B2Noble metal alloy for spark plug and method for producing and processing the sameTANAKA PRECIOUS METAL IND·Filed 2007·Granted Oct 4, 2011·0 cites·17 claims
- 2260US2024408909A1Recording medium, card, and bookletSONY GROUP CORP·Filed 2022·Application pending·0 cites
- 2359US8394728B2Film deposition method and manufacturing method of semiconductor deviceAKAO HIROTAKA·Filed 2010·Granted Mar 12, 2013·2 cites·9 claims
- 2454US5623162ALead frame having cut-out wing leadsNEC CORP·Filed 1995·Granted Apr 22, 1997·21 cites·6 claims
- 2550US11823004B2Information medium, recording apparatus, and reading apparatusSONY GROUP CORP·Filed 2020·Granted Nov 21, 2023·0 cites·18 claims
- 2650US2021362511A1Drawing method and erasing methodSONY CORP·Filed 2019·Application pending·0 cites
- 2750US2023109319A1Recording medium and exterior memberSONY GROUP CORP·Filed 2021·Application pending·0 cites
- 2849US4938923AGold wire for the bonding of a semiconductor deviceKUJIRAOKA TAKESHI·Filed 1989·Granted Jul 3, 1990·19 cites·6 claims
- 2949US2020198225A1Three-dimensional structure and method of manufacturing three-dimensional structureSONY CORP·Filed 2018·Application pending·0 cites
- 3048US2009263590A1Method of manufacturing polysilane-modified silicon fine wire and method of forming silicon filmSONY CORP·Filed 2009·Application pending·0 cites
- 3147US2023132486A1Recording medium and exterior memberSONY GROUP CORP·Filed 2021·Application pending·0 cites
- 3246US2014070193A1Transistor, method of manufacturing transistor, method of manufacturing semiconductor unit, and method of manufacturing display unitSONY CORP·Filed 2013·Application pending·0 cites
- 3345US11590787B2Reversible recording medium, reversible recording medium coating, and exterior memberSONY CORP·Filed 2017·Granted Feb 28, 2023·0 cites·7 claims
- 3445US6143413AMagnetic recording medium and head cleaning tapeSONY CORP·Filed 1997·Granted Nov 7, 2000·7 cites·14 claims
- 3544US11228686B2Request processing apparatus and request accepting apparatusSONY CORP·Filed 2017·Granted Jan 18, 2022·0 cites·5 claims
- 3643US2004101789A1Reversible multicolor recording medium, and recording method using the sameFiled 2003·Application pending·0 cites
- 3743US2019275819A1Reversible recording medium and exterior memberSONY CORP·Filed 2017·Application pending·0 cites
- 3841US2020051128A1Advertisement consideration calculating system and terminal unitSONY CORP·Filed 2017·Application pending·0 cites
- 3940US6208017B1Semiconductor device with lead-on-chip structureNEC CORP·Filed 1995·Granted Mar 27, 2001·10 cites·6 claims
- 4040US2006276335A1Reversible multicolor recording medium and recording method using sameSONY CORP·Filed 2004·Application pending·0 cites
- 4139US11156329B2Light-emitting diode-type illumination deviceABRAM CORP·Filed 2017·Granted Oct 26, 2021·0 cites·6 claims
- 4239US2010320453A1Thin-film transistor and method for producing the sameSONY CORP·Filed 2010·Application pending·0 cites
- 4337US6989356B2Partially-fluorinated-alkyl compound, lubricant comprising the compound, and recording medium using the lubricantSONY CORP·Filed 2003·Granted Jan 24, 2006·3 cites·7 claims
- 4436US5998009AMagnetic recording mediumSONY CORP·Filed 1997·Granted Dec 7, 1999·5 cites·5 claims
- 4536US2004007770A1Semiconductor-mounting substrate used to manufacture electronic packages, and production process for producing such semiconductor-mounting substrateFiled 2003·Application pending·0 cites
- 4633US2012322334A1Method of manufacturing film and method of manufacturing displayKURIHARA KENICHI·Filed 2012·Application pending·0 cites
- 4733US2018149320A1Light-emitting diode type lighting deviceABRAM CORP·Filed 2016·Application pending·0 cites
- 4831US5750261AMagnetic recording medium comprising magnetic particles, binder, and a cure agent of isocyanurate trimers, pentamers and heptamersSONY CORP·Filed 1996·Granted May 12, 1998·2 cites·7 claims
- 4926US4890151AThin-film and its forming methodRICOH KK·Filed 1988·Granted Dec 26, 1989·3 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →