Inventor · disambiguated record
Keisuke Kuriyama
Also filed as: KURIYAMA KEISUKE
8 granted patents·1 pending application·39 citations·filing 2006–2017
78Inventor score
Top patents by PatentIndex Score
9 records- 0194US7357703B2Chemical mechanical polishing pad and chemical mechanical polishing methodJSR CORP·Filed 2006·Granted Apr 15, 2008·36 cites·22 claims
- 0271US10032920B2Thin film transistor and MOS field effect transistor that include hydrophilic/hydrophobic material, and methods for manufacturing the sameJSR CORP·Filed 2017·Granted Jul 24, 2018·2 cites·1 claims
- 0366US7714096B2Resin composition, cured product and optical partsTOKYO INST TECH·Filed 2008·Granted May 11, 2010·1 cites·18 claims
- 0448US10392699B2Method for manufacturing structure having recessed pattern, resin composition, method for forming electroconductive film, electronic circuit, and electronic deviceJSR CORP·Filed 2015·Granted Aug 27, 2019·0 cites·11 claims
- 0548US9746775B2Method for manufacturing substrate having concave pattern, composition, method for forming conductive film, electronic circuit and electronic deviceJSR CORP·Filed 2014·Granted Aug 29, 2017·0 cites·13 claims
- 0646US2010137490A1Resin composition, cured product and optical partsTOKYO INST TECH·Filed 2010·Application pending·0 cites
- 0744US9980392B2Process for producing substrate having wiring, radiation-sensitive composition, electronic circuit and electronic deviceJSR CORP·Filed 2016·Granted May 22, 2018·0 cites·10 claims
- 0843US8053521B2Chemical mechanical polishing padJSR CORP·Filed 2007·Granted Nov 8, 2011·0 cites·16 claims
- 0929US9543201B2Method for forming three-dimensional interconnection, circuit arrangement comprising three-dimensional interconnection, and metal film-forming composition for three-dimensional interconnectionJSR CORP·Filed 2015·Granted Jan 10, 2017·0 cites·16 claims
Join the waitlist — get patent alerts
Get an alert when Keisuke Kuriyama files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →