Inventor · disambiguated record
Keiyo Kusanagi
Also filed as: KUSANAGI KEIYO
13 granted patents·7 pending applications·46 citations·filing 2004–2021
88Inventor score
Technology areasH10W
Files withELPIDA MEMORY INC7MICRON TECHNOLOGY INC6WATANABE MITSUHISA2FUJISHIMA HIROYUKI1HATAKEYAMA KOICHI1
Top patents by PatentIndex Score
20 records- 0188US8274143B2Semiconductor device, method of forming the same, and electronic deviceFUJISHIMA HIROYUKI·Filed 2010·Granted Sep 25, 2012·22 cites·21 claims
- 0282US10453762B2Shielded fan-out packaged semiconductor device and method of manufacturingMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 22, 2019·3 cites·5 claims
- 0377US9466546B2Semiconductor device and method of forming the sameHATAKEYAMA KOICHI·Filed 2011·Granted Oct 11, 2016·5 cites·26 claims
- 0471US8816478B2Semiconductor device having penetration electrode penetrating through semiconductor substrateELPIDA MEMORY INC·Filed 2013·Granted Aug 26, 2014·3 cites·20 claims
- 0569US11742252B2Shielded fan-out packaged semiconductor device and method of manufacturingMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 0669US10147705B2Stacked semiconductor die assemblies with die substrate extensionsMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 4, 2018·1 cites·8 claims
- 0768US8203222B2Semiconductor device and method of manufacturing the sameWATANABE MITSUHISA·Filed 2009·Granted Jun 19, 2012·4 cites·23 claims
- 0865US11335667B2Stacked semiconductor die assemblies with die substrate extensionsMICRON TECHNOLOGY INC·Filed 2020·Granted May 17, 2022·0 cites·18 claims
- 0960US11158554B2Shielded fan-out packaged semiconductor device and method of manufacturingMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 26, 2021·0 cites·16 claims
- 1058US10553566B2Stacked semiconductor die assemblies with die substrate extensionsMICRON TECHNOLOGY INC·Filed 2018·Granted Feb 4, 2020·0 cites·14 claims
- 1156US7372130B2Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangementELPIDA MEMORY INC·Filed 2004·Granted May 13, 2008·8 cites·21 claims
- 1247US2010148172A1Semiconductor deviceELPIDA MEMORY INC·Filed 2009·Application pending·0 cites
- 1345US2008199979A1Semiconductor device and method for fabricating the sameKIKUCHI KOYA·Filed 2008·Application pending·0 cites
- 1441US2014027904A1Semiconductor deviceELPIDA MEMORY INC·Filed 2013·Application pending·0 cites
- 1540US2012252165A1Method for manufacturing a semiconductor deviceNAKANOYA YUSUKE·Filed 2012·Application pending·0 cites
- 1639US8217517B2Semiconductor device provided with wire that electrically connects printed wiring board and semiconductor chip each otherWATANABE MITSUHISA·Filed 2010·Granted Jul 10, 2012·0 cites·18 claims
- 1737US2010252923A1Semiconductor device and method of manufacturing sameELPIDA MEMORY INC·Filed 2010·Application pending·0 cites
- 1836US2010301468A1Semiconductor device and method of manufacturing the sameELPIDA MEMORY INC·Filed 2010·Application pending·0 cites
- 1935US2012118939A1Process and apparatus for manufacturing semiconductor deviceKUSANAGI KEIYO·Filed 2011·Application pending·0 cites
- 2034US7321165B2Semiconductor device and its manufacturing methodELPIDA MEMORY INC·Filed 2004·Granted Jan 22, 2008·0 cites·15 claims
Join the waitlist — get patent alerts
Get an alert when Keiyo Kusanagi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →