Inventor · disambiguated record
Keun-Bong Lee
Also filed as: LEE KEUN · LEE KEUN-BONG
7 granted patents·3 pending applications·10 citations·filing 2007–2020
74Inventor score
Top patents by PatentIndex Score
10 records- 0183US9768106B2Chip-on-film package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 19, 2017·7 cites·20 claims
- 0258US8309458B2Semiconductor device comprising variable-sized contact, method of forming same, and apparatus comprising sameLEE KEUN-BONG·Filed 2011·Granted Nov 13, 2012·2 cites·12 claims
- 0355US7778008B2Capacitor structure and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 17, 2010·1 cites·20 claims
- 0445US10797143B2Semiconductor devices and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 6, 2020·0 cites·15 claims
- 0545US10680008B2Methods of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 9, 2020·0 cites·20 claims
- 0644US2013032951A1Semiconductor device comprising variable-sized contact, method of forming same, and apparatus comprising sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 0743US2008122033A1Semiconductor device and manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0842US11430665B2Methods of manufacturing semiconductor devices and apparatuses for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 30, 2022·0 cites·19 claims
- 0942US7869188B2Capacitor structureSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jan 11, 2011·0 cites·19 claims
- 1033US2012112311A1Electrical Fuses Using Junction Breakdown and Semiconductor Integrated Circuits Including the SameCHO YONG SANG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →