Inventor · disambiguated record
Kevin J. Lee
Also filed as: LEE KEVIN · LEE KEVIN J · LEE KEVIN JANHUAN
73 granted patents·41 pending applications·1,218 citations·filing 1986–2025
99Inventor score
Top patents by PatentIndex Score
114 records- 0197US9041146B2Logic chip including embedded magnetic tunnel junctionsINTEL CORP·Filed 2013·Granted May 26, 2015·30 cites·24 claims
- 0297US7391112B2Capping copper bumpsINTEL CORP·Filed 2005·Granted Jun 24, 2008·91 cites·6 claims
- 0397US6943440B2Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flowINTEL CORP·Filed 2003·Granted Sep 13, 2005·151 cites·14 claims
- 0495US12113948B1Systems and methods of managing spatial groups in multi-user communication sessionsAPPLE INC·Filed 2024·Granted Oct 8, 2024·23 cites·20 claims
- 0595US12099695B1Systems and methods of managing spatial groups in multi-user communication sessionsAPPLE INC·Filed 2024·Granted Sep 24, 2024·27 cites·20 claims
- 0693US8297605B2Multipurpose ball joint assembly and work holding devicesLEE KEVIN J·Filed 2009·Granted Oct 30, 2012·26 cites·9 claims
- 0792US9142510B23D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approachLEE KEVIN J·Filed 2011·Granted Sep 22, 2015·17 cites·19 claims
- 0892US8887085B1Dynamic content navigationCOX DANIEL P·Filed 2008·Granted Nov 11, 2014·53 cites·24 claims
- 0991US11469268B2Damascene-based approaches for embedding spin hall MTJ devices into a logic processor and the resulting structuresINTEL CORP·Filed 2016·Granted Oct 11, 2022·8 cites·20 claims
- 1091US9997563B2Logic chip including embedded magnetic tunnel junctionsINTEL CORP·Filed 2017·Granted Jun 12, 2018·8 cites·24 claims
- 1191US9449913B23D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon viasLEE KEVIN J·Filed 2011·Granted Sep 20, 2016·18 cites·22 claims
- 1291US7964965B2Forming thick metal interconnect structures for integrated circuitsINTEL CORP·Filed 2008·Granted Jun 21, 2011·14 cites·6 claims
- 1391US6077337AChemical-mechanical polishing slurryINTEL CORP·Filed 1998·Granted Jun 20, 2000·80 cites·20 claims
- 1490US11989404B1Time-based visualization of content anchored in timeAPPLE INC·Filed 2022·Granted May 21, 2024·2 cites·27 claims
- 1590US8935620B1Dynamic content managementCOX DANIEL P·Filed 2008·Granted Jan 13, 2015·37 cites·30 claims
- 1690US7030119B1Method for treating chronic pain using MEK inhibitorsWARNER LAMBERT CO·Filed 2000·Granted Apr 18, 2006·45 cites·28 claims
- 1789US9489354B1Masking content while preserving layout of a webpageLEE KEVIN J·Filed 2012·Granted Nov 8, 2016·26 cites·20 claims
- 1887US10290598B2Method and apparatus for forming backside die planar devices and saw filterINTEL CORP·Filed 2014·Granted May 14, 2019·7 cites·15 claims
- 1987US9716066B2Interconnect structure comprising fine pitch backside metal redistribution lines combined with viasINTEL CORP·Filed 2013·Granted Jul 25, 2017·16 cites·16 claims
- 2087US7049076B2Method for assaying protein—protein interactionUNIV COLUMBIA·Filed 2004·Granted May 23, 2006·28 cites·42 claims
- 2187US6214098B1Chemical-mechanical polishing slurryINTEL CORP·Filed 2000·Granted Apr 10, 2001·29 cites·11 claims
- 2287US4685656AMotor racing track fencePAK POY & KNEEBONE PTY LTD·Filed 1986·Granted Aug 11, 1987·81 cites·6 claims
- 2386US9660181B2Logic chip including embedded magnetic tunnel junctionsINTEL CORP·Filed 2013·Granted May 23, 2017·7 cites·24 claims
- 2486US8691747B2Method of treatment based on ATAD2 inhibitorsKRUIDENIER LAURENS·Filed 2011·Granted Apr 8, 2014·21 cites·1 claims
- 2584US10790263B2Integrated circuit die having backside passive components and methods associated therewithINTEL CORP·Filed 2019·Granted Sep 29, 2020·3 cites·11 claims
- 2684US10644064B2Logic chip including embedded magnetic tunnel junctionsINTEL CORP·Filed 2018·Granted May 5, 2020·4 cites·20 claims
- 2784US8017398B2Method for assaying protein-protein interactionLIFE TECHNOLOGIES CORP·Filed 2006·Granted Sep 13, 2011·8 cites·23 claims
- 2884US5267620ADrilling latch apparatusLONGYEAR CO·Filed 1992·Granted Dec 7, 1993·90 cites·44 claims
- 2983US6304830B1Automatic keyboard testing apparatusBEHAVIOR TECH COMPUTER CORP·Filed 1999·Granted Oct 16, 2001·47 cites·24 claims
- 3080US10811595B2Techniques for forming logic including integrated spin-transfer torque magnetoresistive random-access memoryINTEL CORP·Filed 2016·Granted Oct 20, 2020·2 cites·21 claims
- 3180US6346144B1Chemical-mechanical polishing slurryINTEL CORP·Filed 2000·Granted Feb 12, 2002·17 cites·6 claims
- 3279US7064446B2Under bump metallization layer to enable use of high tin content solder bumpsINTEL CORP·Filed 2004·Granted Jun 20, 2006·29 cites·6 claims
- 3378US7498252B2Dual layer dielectric stack for microelectronics having thick metal linesINTEL CORP·Filed 2006·Granted Mar 3, 2009·8 cites·13 claims
- 3478US7238798B2Nucleic acids and proteins of insect Or83b odorant receptor genes and uses thereofSENTISEARCH INC·Filed 2002·Granted Jul 3, 2007·5 cites·13 claims
- 3577US8933564B2Landing structure for through-silicon viaPELTO CHRISTOPHER M·Filed 2012·Granted Jan 13, 2015·6 cites·27 claims
- 3677US8704336B2Selective removal of on-die redistribution interconnects from scribe-linesHE JUN·Filed 2007·Granted Apr 22, 2014·6 cites·7 claims
- 3776US11393873B2Approaches for embedding spin hall MTJ devices into a logic processor and the resulting structuresINTEL CORP·Filed 2016·Granted Jul 19, 2022·2 cites·16 claims
- 3876US9252111B2Method for handling very thin device wafersINTEL CORP·Filed 2015·Granted Feb 2, 2016·2 cites·14 claims
- 3976US8994174B2Structure having a planar bonding surfaceLEE KEVIN J·Filed 2011·Granted Mar 31, 2015·3 cites·6 claims
- 4076US7732936B2Buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymerINTEL CORP·Filed 2006·Granted Jun 8, 2010·6 cites·21 claims
- 4174US9721886B2Preservation of fine pitch redistribution linesINTEL CORP·Filed 2013·Granted Aug 1, 2017·5 cites·25 claims
- 4274US7601829B2Nucleic acids and proteins of insect Or83b odorant receptor genes and uses thereofSENTISEARCH INC·Filed 2007·Granted Oct 13, 2009·1 cites·9 claims
- 4374US7550574B2Nucleic acids and proteins of insect Or83b odorant receptor genes and uses thereofSENTISEARCH INC·Filed 2007·Granted Jun 23, 2009·1 cites·4 claims
- 4473US9911689B2Through-body-via isolated coaxial capacitor and techniques for forming sameINTEL CORP·Filed 2013·Granted Mar 6, 2018·3 cites·7 claims
- 4571US6384481B1Single step electroplating process for interconnect via fill and metal line patterningINTEL CORP·Filed 1999·Granted May 7, 2002·33 cites·5 claims
- 4671US6020266ASingle step electroplating process for interconnect via fill and metal line patterningINTEL CORP·Filed 1997·Granted Feb 1, 2000·33 cites·18 claims
- 4770US7585615B2Composite photoresist for modifying die-side bumpsINTEL CORP·Filed 2006·Granted Sep 8, 2009·4 cites·10 claims
- 4868US7982311B2Solder limiting layer for integrated circuit die copper bumpsINTEL CORP·Filed 2008·Granted Jul 19, 2011·3 cites·22 claims
- 4968US7088005B2Wafer stacking with anisotropic conductive adhesiveINTEL CORP·Filed 2003·Granted Aug 8, 2006·12 cites·15 claims
- 5068US2020227472A1Logic chip including embedded magnetic tunnel junctionsINTEL CORP·Filed 2020·Application pending·0 cites
Showing the top 50 of 114 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →