Inventor · disambiguated record
Keng-Ping Lin
Also filed as: LIN KENG-PING
6 granted patents·3 pending applications·0 citations·filing 2018–2024
65Inventor score
Files withWINBOND ELECTRONICS CORP9
Top patents by PatentIndex Score
9 records- 0171US12262528B2Manufacturing method of memory structureWINBOND ELECTRONICS CORP·Filed 2022·Granted Mar 25, 2025·0 cites·20 claims
- 0265US11527537B2Memory structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2021·Granted Dec 13, 2022·0 cites·7 claims
- 0364US11610897B2Landing pad structureWINBOND ELECTRONICS CORP·Filed 2021·Granted Mar 21, 2023·0 cites·10 claims
- 0461US2025227922A1Semiconductor device and formation method thereofWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0558US2025167124A1Semiconductor structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0655US11011525B2Landing pad structure and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted May 18, 2021·0 cites·7 claims
- 0750US2024334685A1Dynamic random access memory and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 0848US11289493B2Patterning methodWINBOND ELECTRONICS CORP·Filed 2019·Granted Mar 29, 2022·0 cites·14 claims
- 0937US10985262B2Semiconductor structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2018·Granted Apr 20, 2021·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →