Inventor · disambiguated record
Kelly Lofgreen
Also filed as: LOFGREEN KELLY · LOFGREEN KELLY P · LOFGREEN Kelly Porter
16 granted patents·9 pending applications·27 citations·filing 2006–2024
89Inventor score
Top patents by PatentIndex Score
25 records- 0194US9418912B2Methods of forming serpentine thermal interface material and structures formed therebyINTEL CORP·Filed 2015·Granted Aug 16, 2016·10 cites·18 claims
- 0292US12238892B2Immersion cooling for integrated circuit devicesINTEL CORP·Filed 2020·Granted Feb 25, 2025·3 cites·15 claims
- 0388US10651108B2Foam compositeINTEL CORP·Filed 2016·Granted May 12, 2020·4 cites·7 claims
- 0482US11464139B2Conformable heat sink interface with a high thermal conductivityINTEL CORP·Filed 2018·Granted Oct 4, 2022·3 cites·20 claims
- 0581US11676883B2Thermoelectric coolers combined with phase-change material in integrated circuit packagesINTEL CORP·Filed 2019·Granted Jun 13, 2023·2 cites·23 claims
- 0674US11551994B2Liquid metal TIM with STIM-like performance with no BSM and BGA compatibleINTEL CORP·Filed 2018·Granted Jan 10, 2023·2 cites·22 claims
- 0773US11694942B2Annular silicon-embedded thermoelectric cooling devices for localized on-die thermal managementINTEL CORP·Filed 2018·Granted Jul 4, 2023·2 cites·15 claims
- 0869US9230877B2Methods of forming serpentine thermal interface material and structures formed therebyINTEL CORP·Filed 2012·Granted Jan 5, 2016·1 cites·41 claims
- 0961US2025014967A1Methods and apparatus to improve thermal dissipation and mechanical loading of integrated circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 1057US12366713B2Heat dissipation structures for optical communication devicesINTEL CORP·Filed 2021·Granted Jul 22, 2025·0 cites·25 claims
- 1154US12392818B2Enhanced jet impingement leak prevention for integrated circuitINTEL CORP·Filed 2022·Granted Aug 19, 2025·0 cites·17 claims
- 1251US11798861B2Integrated heat spreader (IHS) with heating elementINTEL CORP·Filed 2019·Granted Oct 24, 2023·0 cites·20 claims
- 1350US10461011B2Microelectronics package with an integrated heat spreader having indentationsINTEL CORP·Filed 2017·Granted Oct 29, 2019·0 cites·25 claims
- 1448US11756856B2Package architecture including thermoelectric cooler structuresINTEL CORP·Filed 2018·Granted Sep 12, 2023·0 cites·14 claims
- 1547US11869824B2Thermal interface structures for integrated circuit packagesINTEL CORP·Filed 2019·Granted Jan 9, 2024·0 cites·25 claims
- 1647US11658095B2Bump integrated thermoelectric coolerINTEL CORP·Filed 2019·Granted May 23, 2023·0 cites·15 claims
- 1746US11462457B2Using a thermoelectric cooler to reduce heat transfer between heat-conducting platesINTEL CORP·Filed 2018·Granted Oct 4, 2022·0 cites·18 claims
- 1842US2021125896A1Filled liquid metal thermal interface materialsINTEL CORP·Filed 2019·Application pending·0 cites
- 1940US2014262129A1Thermal control of device using fluid coolantLI ZHIHUA·Filed 2013·Application pending·0 cites
- 2038US2019393118A1Semiconductor package with sealed thermal interface cavity with low thermal resistance liquid thermal interface materialINTEL CORP·Filed 2018·Application pending·0 cites
- 2136US2017186667A1Cooling of electronics using folded foil microchannelsINTEL CORP·Filed 2015·Application pending·0 cites
- 2234US2017179000A1Thermoelectric cooler having a solderless electrodeINTEL CORP·Filed 2015·Application pending·0 cites
- 2333US2014354314A1Thermal interface techniques and configurationsARORA HITESH·Filed 2013·Application pending·0 cites
- 2432US2008160330A1Copper-elastomer hybrid thermal interface material to cool under-substrate siliconSONG DAVID·Filed 2006·Application pending·0 cites
- 2531US2018068926A1Energy storage material for thermal management and associated techniques and configurationsINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →