Inventor · disambiguated record
Keumhee Ma
Also filed as: MA KEUMHEE
5 granted patents·5 pending applications·48 citations·filing 2009–2024
74Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0192US8026592B2Through-silicon via structures including conductive protective layersSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Sep 27, 2011·45 cites·18 claims
- 0285US11626370B2Interconnection structure of a semiconductor chip and semiconductor package including the interconnection structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 11, 2023·2 cites·20 claims
- 0379US11688667B2Semiconductor package including a pad patternSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 27, 2023·1 cites·20 claims
- 0466US12315818B2Interconnection structure of a semiconductor chip having pads of different widths and semiconductor package including the interconnection structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 27, 2025·0 cites·13 claims
- 0559US2025192082A1Semiconductor package including stacked chipsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0655US11145573B2Semiconductor package including a pad patternSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 12, 2021·0 cites·20 claims
- 0755US2025210556A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0854US2025118714A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0954US2025192083A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1040US2011318917A1Methods of forming through-silicon via structures including conductive protective layersYOON MINSEUNG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →