Inventor · disambiguated record
Keiichi Maeda
Also filed as: MAEDA KEIICHI
25 granted patents·6 pending applications·394 citations·filing 1991–2021
96Inventor score
Files withSONY CORP12KOMATSU MFG CO LTD5SONY SEMICONDUCTOR SOLUTIONS CORP3MAEDA KEIICHI2MITSUBISHI CABLE IND LTD2
Top patents by PatentIndex Score
31 records- 0196US6844085B2Copper based sintered contact material and double-layered sintered contact memberKOMATSU MFG CO LTD·Filed 2002·Granted Jan 18, 2005·48 cites·15 claims
- 0288US11170987B1Short-arc discharge lampUSHIO ELECTRIC INC·Filed 2021·Granted Nov 9, 2021·2 cites·6 claims
- 0385US9136304B2Solid-state imaging device, semiconductor device, manufacturing methods thereof, and electronic apparatusMAEDA KEIICHI·Filed 2011·Granted Sep 15, 2015·11 cites·20 claims
- 0481US6361662B1Method for fabricating a semiconductor device in a magnetron sputtering systemSONY CORP·Filed 1997·Granted Mar 26, 2002·66 cites·2 claims
- 0579US6043145AMethod for making multilayer wiring structureSONY CORP·Filed 1997·Granted Mar 28, 2000·66 cites·16 claims
- 0671US5991261AWrite inhibit tab for disc cartridgeVICTOR COMPANY OF JAPAN·Filed 1997·Granted Nov 23, 1999·22 cites·5 claims
- 0767US5719446AMultilayer interconnect structure for semiconductor device and method of manufacturing sameSONY CORP·Filed 1997·Granted Feb 17, 1998·39 cites·7 claims
- 0866US7851236B2Film thickness prediction method, layout design method, mask pattern design method of exposure mask, and fabrication method of semiconductor integrated circuitSONY CORP·Filed 2009·Granted Dec 14, 2010·2 cites·11 claims
- 0959US7261951B2Copper based sintered contact material and double-layered sintered contact memberKOMATSU MFG CO LTD·Filed 2004·Granted Aug 28, 2007·1 cites·15 claims
- 1059US7056598B2Copper based sintered contact material and double-layered sintered contact memberKOMATSU MFG CO LTD·Filed 2004·Granted Jun 6, 2006·1 cites·12 claims
- 1157US5776830AProcess for fabricating connection structuresSONY CORP·Filed 1997·Granted Jul 7, 1998·22 cites·3 claims
- 1257US5449641AMethod for fabricating an interconnect for semiconductor devices using (111) crystal plane orientationSONY CORP·Filed 1994·Granted Sep 12, 1995·20 cites·4 claims
- 1353US10866467B2Liquid crystal display unit and projection display unitSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2017·Granted Dec 15, 2020·0 cites·13 claims
- 1453US5581125AInterconnect for semiconductor devices and method for fabricating sameSONY CORP·Filed 1995·Granted Dec 3, 1996·16 cites·6 claims
- 1552US7087318B2Copper based sintered contact material and double-layered sintered contact memberKOMATSU MFG CO LTD·Filed 2004·Granted Aug 8, 2006·0 cites·12 claims
- 1652US6241869B1Apparatus and method for electroplatingSONY CORP·Filed 1999·Granted Jun 5, 2001·14 cites·7 claims
- 1751US5523702ASequentially switching output buffersTOSHIBA KK·Filed 1994·Granted Jun 4, 1996·11 cites·3 claims
- 1851US2011157446A1Image sensor and method of manufacturing the same, and sensor deviceSONY CORP·Filed 2010·Application pending·0 cites
- 1950US5396981AFlexible screw and transport apparatus comprising sameMITSUBISHI CABLE IND LTD·Filed 1993·Granted Mar 14, 1995·11 cites·18 claims
- 2046US6268290B1Method of forming wiringsSONY CORP·Filed 1994·Granted Jul 31, 2001·15 cites·7 claims
- 2145US5404056ASemiconductor integrated circuit device with independently operable output buffersTOSHIBA KK·Filed 1993·Granted Apr 4, 1995·8 cites·7 claims
- 2244US11971633B2Electrode structure, liquid crystal display device, projective display device, and method of manufacturing electrode structureSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Granted Apr 30, 2024·0 cites·18 claims
- 2343US2022390783A1Transistor array substrate, method of producing transistor array substrate, liquid crystal display device, and electronic apparatusSONY GROUP CORP·Filed 2020·Application pending·0 cites
- 2443US2003209103A1Cooper-based sintering sliding material and multi-layered sintered sliding memberKOMATSU MFG CO LTD·Filed 2003·Application pending·0 cites
- 2542US10908444B2Display device, method for producing display device, and display apparatus of projection typeSONY CORP·Filed 2016·Granted Feb 2, 2021·0 cites·11 claims
- 2641US2023073217A1Optical compensation element, method for manufacturing optical compensation element, liquid crystal display device, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Application pending·0 cites
- 2740US6051490AMethod of forming wiringsSONY CORP·Filed 1997·Granted Apr 18, 2000·9 cites·8 claims
- 2839US5402955AReel-locking mechanism for compact tape cassetteVICTOR COMPANY OF JAPAN·Filed 1992·Granted Apr 4, 1995·4 cites·14 claims
- 2939US5295573AFlexible screw and transport apparatus comprising sameMITSUBISHI CABLE IND LTD·Filed 1991·Granted Mar 22, 1994·6 cites·17 claims
- 3039US2001035346A1Apparatus and method for electroplatingFiled 2001·Application pending·0 cites
- 3138US2009019244A1Information Record/Read ApparatusMAEDA KEIICHI·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →