Inventor · disambiguated record
Kenya Moriya
Also filed as: MORIYA KENYA
0 granted patents·2 pending applications·0 citations·filing 2022–2023
Technology areasH10P
Files withRESONAC CORP2
Top patents by PatentIndex Score
2 records- 0147US2025167034A1Integrated dicing/die bonding film, method for producing same, and method for producing semiconductor deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 0244US2025293075A1Die bonding film and method for manufacturing same, dicing/die bonding integrated film and method for manufacturing same, and method for manufacturing semiconductor deviceRESONAC CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →