Inventor · disambiguated record
Kenichi Moriyama
Also filed as: MORIYAMA KENICHI
3 granted patents·37 citations·filing 1992–2002
71Inventor score
Top patents by PatentIndex Score
3 records- 0167US7232528B2Surface treatment agent for copper and copper alloyMITSUBISHI GAS CHEMICAL CO·Filed 2002·Granted Jun 19, 2007·9 cites·11 claims
- 0252US5242540AProcess for producing thin copper foil-clad circuit board substrateMITSUBISHI GAS CHEMICAL CO·Filed 1992·Granted Sep 7, 1993·17 cites·5 claims
- 0344US5802901AProcess for correcting the distortion of electrolytic seed platesSUMITOMO METAL MINING CO·Filed 1997·Granted Sep 8, 1998·11 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →