Inventor · disambiguated record
Kesvakumar V. C. Muniandy
Also filed as: MUNIANDY KESVAKUMAR V · MUNIANDY KESVAKUMAR V C
10 granted patents·6 pending applications·125 citations·filing 2006–2015
88Inventor score
Files withMUNIANDY KESVAKUMAR V C8KALANDAR NAVAS KHAN ORATTI5IBRAHIM RUZAINI1MENG DOMINIC KOEY POH1SUKEMI NORAZHAM MOHD1
Top patents by PatentIndex Score
16 records- 0196US8669140B1Method of forming stacked die package using redistributed chip packagingMUNIANDY KESVAKUMAR V C·Filed 2013·Granted Mar 11, 2014·51 cites·20 claims
- 0295US9064718B1Pre-formed via array for integrated circuit packageMUNIANDY KESVAKUMAR V C·Filed 2014·Granted Jun 23, 2015·37 cites·18 claims
- 0392US8772913B1Stiffened semiconductor die packageMUNIANDY KESVAKUMAR V C·Filed 2013·Granted Jul 8, 2014·14 cites·9 claims
- 0487US9034694B1Embedded die ball grid array packageKALANDAR NAVAS KHAN ORATTI·Filed 2014·Granted May 19, 2015·9 cites·12 claims
- 0572US8980696B2Method of packaging semiconductor dieMENG DOMINIC KOEY POH·Filed 2011·Granted Mar 17, 2015·6 cites·16 claims
- 0672US8836098B1Surface mount semiconductor device with solder ball reinforcement frameSUKEMI NORAZHAM MOHD·Filed 2013·Granted Sep 16, 2014·6 cites·13 claims
- 0771US8945989B2Stiffened semiconductor die packageMUNIANDY KESVAKUMAR V C·Filed 2014·Granted Feb 3, 2015·2 cites·11 claims
- 0847US9299675B2Embedded die ball grid array packageKALANDAR NAVAS KHAN ORATTI·Filed 2015·Granted Mar 29, 2016·0 cites·7 claims
- 0943US2016056094A1Ball grid array package with more signal routing structuresMUNIANDY KESVAKUMAR V C·Filed 2014·Application pending·0 cites
- 1042US2015187728A1Emiconductor device with die top power connectionsMUNIANDY KESVAKUMAR V C·Filed 2013·Application pending·0 cites
- 1141US2015115420A1Sensor die grid array packageKALANDAR NAVAS KHAN ORATTI·Filed 2013·Application pending·0 cites
- 1240US8853058B2Method of making surface mount stacked semiconductor devicesMUNIANDY KESVAKUMAR V C·Filed 2012·Granted Oct 7, 2014·0 cites·20 claims
- 1340US2014231977A1Semiconductor packages with low stand-off interconnections between chipsKALANDAR NAVAS KHAN ORATTI·Filed 2013·Application pending·0 cites
- 1440US2015206769A1Lead frame based semiconductor device with power barsMUNIANDY KESVAKUMAR V C·Filed 2014·Application pending·0 cites
- 1538US8810020B2Semiconductor device with redistributed contactsKALANDAR NAVAS KHAN ORATTI·Filed 2012·Granted Aug 19, 2014·0 cites·7 claims
- 1638US2007200225A1Heat sink for semiconductor packageIBRAHIM RUZAINI·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →