Inventor · disambiguated record
Keiichi Naito
Also filed as: NAITO KEIICHI
9 granted patents·57 citations·filing 1975–2005
86Inventor score
Top patents by PatentIndex Score
9 records- 0168US4033840AThermosetting acryloyloxy-terminate butadiene polymersSONY CORP·Filed 1975·Granted Jul 5, 1977·16 cites·6 claims
- 0264US6562250B1Method for manufacturing wiring circuit boards with bumps and method for forming bumpsSONY CHEMICALS CORP·Filed 2000·Granted May 13, 2003·10 cites·3 claims
- 0363US7520053B2Method for manufacturing a bump-attached wiring circuit boardSONY CORP·Filed 2005·Granted Apr 21, 2009·2 cites·8 claims
- 0452US4158725AMethod of manufacturing an adhesiveSONY CORP·Filed 1978·Granted Jun 19, 1979·12 cites·10 claims
- 0549US6518510B2Bump-attached wiring circuit board and method for manufacturing sameSONY CHEMICALS CORP·Filed 2001·Granted Feb 11, 2003·3 cites·8 claims
- 0644US7020961B2Method for manufacturing a bump-attached wiring circuit boardSONY CORP·Filed 2002·Granted Apr 4, 2006·1 cites·8 claims
- 0741US6977349B2Method for manufacturing wiring circuit boards with bumps and method for forming bumpsSONY CHEMICALS CORP·Filed 2003·Granted Dec 20, 2005·0 cites·3 claims
- 0841US4027063AFlame retardant thermosetting resinSONY CORP·Filed 1975·Granted May 31, 1977·8 cites·15 claims
- 0933US4323659ANon-flammable adhesive compositionsSONY CORP·Filed 1980·Granted Apr 6, 1982·5 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →