Inventor · disambiguated record
Kenta Nakahara
Also filed as: NAKAHARA KENTA
11 granted patents·6 pending applications·21 citations·filing 2014–2022
83Inventor score
Files withMITSUBISHI ELECTRIC CORP17
Top patents by PatentIndex Score
17 records- 0193US9412679B1Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Aug 9, 2016·13 cites·10 claims
- 0278US10515863B2Power module and power conversion apparatus including case and elastic memberMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Dec 24, 2019·3 cites·11 claims
- 0377US10325895B2Semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jun 18, 2019·3 cites·17 claims
- 0473US9583407B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Feb 28, 2017·2 cites·8 claims
- 0563US11664288B2Method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted May 30, 2023·0 cites·11 claims
- 0655US11195770B2Method of manufacturing semiconductor device, semiconductor device, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Dec 7, 2021·0 cites·6 claims
- 0752US2025300045A1Semiconductor device and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 0850US2024234218A9Method for manufacturing substrate and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 0949US2024395690A1Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1047US12051636B2Power moduleMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Jul 30, 2024·0 cites·5 claims
- 1147US9257363B2Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Feb 9, 2016·0 cites·12 claims
- 1247US2024222349A1Power moduleMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1346US2024071868A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1445US2025069981A1Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1544US10971424B2Power module and power convertorMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Apr 6, 2021·0 cites·13 claims
- 1640US10068819B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Sep 4, 2018·0 cites·9 claims
- 1738US10204886B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Feb 12, 2019·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →