Inventor · disambiguated record
Keisuke Nakatsuka
Also filed as: NAKATSUKA KEISUKE
53 granted patents·18 pending applications·32 citations·filing 2012–2025
96Inventor score
Top patents by PatentIndex Score
71 records- 0188US11422712B2Storage device and storage system including a memory to store a check code for an integrity checkKIOXIA CORP·Filed 2020·Granted Aug 23, 2022·2 cites·24 claims
- 0287US11107508B2Semiconductor memory deviceTOSHIBA MEMORY CORP·Filed 2019·Granted Aug 31, 2021·5 cites·19 claims
- 0385US2025344387A1Memory deviceKIOXIA CORP·Filed 2025·Application pending·0 cites
- 0478US9190452B2Semiconductor memory deviceNAKATSUKA KEISUKE·Filed 2013·Granted Nov 17, 2015·4 cites·9 claims
- 0577US2025343141A1Semiconductor memory deviceKIOXIA CORP·Filed 2025·Application pending·0 cites
- 0672US12382632B2Memory deviceKIOXIA CORP·Filed 2022·Granted Aug 5, 2025·0 cites·20 claims
- 0772US10049711B2Magnetoresistive memory deviceTOSHIBA MEMORY CORP·Filed 2016·Granted Aug 14, 2018·3 cites·28 claims
- 0872US9934834B2Magnetoresistive memory deviceTOSHIBA MEMORY CORP·Filed 2016·Granted Apr 3, 2018·3 cites·20 claims
- 0971US11121147B2Semiconductor storage deviceTOSHIBA MEMORY CORP·Filed 2019·Granted Sep 14, 2021·2 cites·9 claims
- 1070US10748920B2Semiconductor memory deviceTOSHIBA MEMORY CORP·Filed 2018·Granted Aug 18, 2020·1 cites·10 claims
- 1170US9887237B2Magnetic storage deviceTOSHIBA MEMORY CORP·Filed 2016·Granted Feb 6, 2018·3 cites·4 claims
- 1270US2025239553A1Semiconductor memory deviceKIOXIA CORP·Filed 2025·Application pending·0 cites
- 1369US12381147B2Chip bonded semiconductor memory device with different charge storage filmsKIOXIA CORP·Filed 2023·Granted Aug 5, 2025·0 cites·10 claims
- 1469US11289505B2Semiconductor memory deviceKIOXIA CORP·Filed 2020·Granted Mar 29, 2022·1 cites·18 claims
- 1569US2025393210A1Semiconductor deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 1667US12444681B2Semiconductor device and method for manufacturing the sameKIOXIA CORP·Filed 2022·Granted Oct 14, 2025·0 cites·16 claims
- 1767US12300650B2Semiconductor memory deviceKIOXIA CORP·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 1867US12232325B2Semiconductor storage deviceKIOXIA CORP·Filed 2021·Granted Feb 18, 2025·0 cites·6 claims
- 1967US10991713B2Semiconductor memory deviceTOSHIBA MEMORY CORP·Filed 2019·Granted Apr 27, 2021·2 cites·15 claims
- 2067US2025287596A1Memory device and method of manufacturing memory deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 2166US11942431B2Semiconductor device and manufacturing method thereofKIOXIA CORP·Filed 2022·Granted Mar 26, 2024·0 cites·13 claims
- 2265US12438111B2Semiconductor device, wafer, and wafer manufacturing methodKIOXIA CORP·Filed 2022·Granted Oct 7, 2025·0 cites·6 claims
- 2364US11574663B2Data latch circuit and semiconductor memory deviceKIOXIA CORP·Filed 2020·Granted Feb 7, 2023·0 cites·8 claims
- 2464US9773539B2Logical operation circuit and memory deviceNAKATSUKA KEISUKE·Filed 2015·Granted Sep 26, 2017·1 cites·15 claims
- 2563US12463164B2Semiconductor memory deviceKIOXIA CORP·Filed 2022·Granted Nov 4, 2025·0 cites·13 claims
- 2663US9401386B2Semiconductor memory deviceNAKATSUKA KEISUKE·Filed 2015·Granted Jul 26, 2016·1 cites·9 claims
- 2762US12384624B2Storage device and control methodKIOXIA CORP·Filed 2022·Granted Aug 12, 2025·0 cites·20 claims
- 2862US12204765B2Memory systemKIOXIA CORP·Filed 2023·Granted Jan 21, 2025·0 cites·19 claims
- 2962US10867641B2Data latch circuit and semiconductor memory deviceTOSHIBA MEMORY CORP·Filed 2019·Granted Dec 15, 2020·1 cites·10 claims
- 3062US2021202524A1Semiconductor memory deviceTOSHIBA MEMORY CORP·Filed 2021·Application pending·0 cites
- 3162US2025280547A1Memory deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 3259US9082640B2Pass gate and semiconductor storage device having the sameTOSHIBA KK·Filed 2013·Granted Jul 14, 2015·2 cites·19 claims
- 3359US2024315037A1Semiconductor device and semiconductor device manufacturing methodKIOXIA CORP·Filed 2024·Application pending·0 cites
- 3458US11437324B2Semiconductor device and manufacturing method thereofKIOXIA CORP·Filed 2020·Granted Sep 6, 2022·0 cites·16 claims
- 3558US10311929B2Resistance change memoryTOSHIBA MEMORY CORP·Filed 2017·Granted Jun 4, 2019·1 cites·7 claims
- 3658US2024315024A1Semiconductor device and method of manufacturing the sameKIOXIA CORP·Filed 2024·Application pending·0 cites
- 3758US2024315019A1Semiconductor storage deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 3857US12347513B2Semiconductor memory deviceKIOXIA CORP·Filed 2022·Granted Jul 1, 2025·0 cites·18 claims
- 3957US12349359B2Semiconductor memory deviceKIOXIA CORP·Filed 2022·Granted Jul 1, 2025·0 cites·25 claims
- 4057US8659061B2Solid-state image capturing elementNAKATSUKA KEISUKE·Filed 2012·Granted Feb 25, 2014·0 cites·6 claims
- 4155US12507415B2Semiconductor memory deviceKIOXIA CORP·Filed 2022·Granted Dec 23, 2025·0 cites·9 claims
- 4255US10978471B2Semiconductor memory deviceTOSHIBA MEMORY CORP·Filed 2019·Granted Apr 13, 2021·0 cites·14 claims
- 4354US11923325B2Storage system, memory chip unit, and waferKIOXIA CORP·Filed 2022·Granted Mar 5, 2024·0 cites·29 claims
- 4454US11862246B2Memory systemKIOXIA CORP·Filed 2021·Granted Jan 2, 2024·0 cites·19 claims
- 4554US2025226031A1Semiconductor memory deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 4654US2023307369A1Semiconductor memory device and method for manufacturing semiconductor memory deviceKIOXIA CORP·Filed 2022·Application pending·0 cites
- 4753US12142324B2Semiconductor storage device and systemKIOXIA CORP·Filed 2022·Granted Nov 12, 2024·0 cites·19 claims
- 4853US11450611B2Semiconductor device and method of manufacturing the sameKIOXIA CORP·Filed 2020·Granted Sep 20, 2022·0 cites·18 claims
- 4952US9620565B2Semiconductor memory deviceTOSHIBA KK·Filed 2016·Granted Apr 11, 2017·0 cites·12 claims
- 5049US11411016B2Semiconductor memory deviceKIOXIA CORP·Filed 2020·Granted Aug 9, 2022·0 cites·12 claims
Showing the top 50 of 71 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →