Inventor · disambiguated record
Keisuke Niida
Also filed as: NIIDA KEISUKE
16 granted patents·9 pending applications·4 citations·filing 2016–2025
85Inventor score
Files withSHINETSU CHEMICAL CO25
Top patents by PatentIndex Score
25 records- 0175US10864366B2Bio-electrode composition, bio-electrode, and method for manufacturing bio-electrodeSHINETSU CHEMICAL CO·Filed 2018·Granted Dec 15, 2020·2 cites·20 claims
- 0274US10604618B2Compound, method for manufacturing the compound, and composition for forming organic filmSHINETSU CHEMICAL CO·Filed 2018·Granted Mar 31, 2020·1 cites·13 claims
- 0370US11022882B2Compound and composition for forming organic filmSHINETSU CHEMICAL CO·Filed 2018·Granted Jun 1, 2021·1 cites·3 claims
- 0462US2023400770A1Resist Underlayer Film Material, Patterning Process, And Method For Forming Resist Underlayer FilmSHINETSU CHEMICAL CO·Filed 2023·Application pending·0 cites
- 0562US2025231486A1Composition for forming organic film, method for forming organic film, and patterning processSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 0662US2025231487A1Composition for forming organic film, method for forming organic film, patterning process, and surfactantSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 0762US2025232984A1Composition for forming organic film, method for forming organic film, patterning process, and surfactantSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 0861US2025095989A1Composition For Forming Organic Film, Method For Forming Organic Film, And Patterning ProcessSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 0959US2025028246A1Composition For Forming Resist Underlayer Film, Patterning Process, And Method For Forming Resist Underlayer FilmSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 1058US10934463B2Adhesive film, method for forming an adhesive film, and urethane polymerSHINETSU CHEMICAL CO·Filed 2019·Granted Mar 2, 2021·0 cites·10 claims
- 1156US11886118B2Material for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and compound for forming organic filmSHINETSU CHEMICAL CO·Filed 2021·Granted Jan 30, 2024·0 cites·33 claims
- 1255US2025326894A1Composition for forming organic film, method for forming organic film, patterning process, and polymerSHINETSU CHEMICAL CO·Filed 2025·Application pending·0 cites
- 1355US2023152702A1Material for forming filling film for inhibiting semiconductor substrate pattern collapse, and method for treating semiconductor substrateSHINETSU CHEMICAL CO·Filed 2022·Application pending·0 cites
- 1454US2023161258A1Material for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, and patterning processSHINETSU CHEMICAL CO·Filed 2022·Application pending·0 cites
- 1553US12332567B2Composition for forming silicon-containing resist underlayer film, patterning process, and silicon compoundSHINETSU CHEMICAL CO·Filed 2021·Granted Jun 17, 2025·0 cites·19 claims
- 1653US12105420B2Coating-type composition for forming organic film, patterning process, polymer, and method for manufacturing polymerSHINETSU CHEMICAL CO·Filed 2021·Granted Oct 1, 2024·0 cites·21 claims
- 1753US11851530B2Material for forming organic film, patterning process, and polymerSHINETSU CHEMICAL CO·Filed 2021·Granted Dec 26, 2023·0 cites·21 claims
- 1853US11676814B2Material for forming organic film, substrate for manufacturing semiconductor apparatus, method for forming organic film, and patterning processSHINETSU CHEMICAL CO·Filed 2020·Granted Jun 13, 2023·0 cites·23 claims
- 1951US11500292B2Material for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and compound for forming organic filmSHINETSU CHEMICAL CO·Filed 2020·Granted Nov 15, 2022·0 cites·25 claims
- 2046US11692066B2Material for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and compound for forming organic filmSHINETSU CHEMICAL CO·Filed 2020·Granted Jul 4, 2023·0 cites·21 claims
- 2146US11635691B2Composition for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and polymerSHINETSU CHEMICAL CO·Filed 2020·Granted Apr 25, 2023·0 cites·21 claims
- 2246US11307497B2Compound, composition for forming organic film, substrate for manufacturing semiconductor apparatus, method for forming organic film, and patterning processSHINETSU CHEMICAL CO·Filed 2019·Granted Apr 19, 2022·0 cites·17 claims
- 2344US10998197B2Polymer and composition for forming organic film, substrate for manufacturing semiconductor apparatus, method for forming organic film, and patterning processSHINETSU CHEMICAL CO·Filed 2018·Granted May 4, 2021·0 cites·20 claims
- 2442US11181821B2Composition for forming organic film, substrate for manufacturing semiconductor apparatus, method for forming organic film, patterning process, and polymerSHINETSU CHEMICAL CO·Filed 2018·Granted Nov 23, 2021·0 cites·5 claims
- 2536US10109485B2Silicon-containing condensate, composition for forming a silicon-containing resist under layer film, and patterning processSHINETSU CHEMICAL CO·Filed 2016·Granted Oct 23, 2018·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →