Inventor · disambiguated record
Keisuke Nishido
Also filed as: NISHIDO Keisuke
2 granted patents·4 pending applications·4 citations·filing 2018–2023
51Inventor score
Top patents by PatentIndex Score
6 records- 0190US12084599B2Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation materialRESONAC CORP·Filed 2023·Granted Sep 10, 2024·2 cites·7 claims
- 0275US11840648B2Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation materialHITACHI CHEMICAL CO LTD·Filed 2018·Granted Dec 12, 2023·2 cites·11 claims
- 0342US2024395568A1Method for manufacturing semiconductor device, temporary-fixing material, and application for manufacturing semiconductor device of temporary-fixing materialRESONAC CORP·Filed 2022·Application pending·0 cites
- 0441US2025329548A1Method of manufacturing semiconductor device, and semiconductor deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 0539US2022028722A1Semiconductor device production method and laminate film for temporary fixation materialSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
- 0632US2024112941A1Method for manufacturing electronic component device and electronic component deviceSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →