Inventor · disambiguated record
Kei Ogawa
Also filed as: OGAWA KEI
1 granted patent·3 pending applications·3 citations·filing 2003–2025
23Inventor score
Top patents by PatentIndex Score
4 records- 0159US2025189151A1Air conditioner unit management device and air conditioner unit management methodCARRIER JAPAN CORP·Filed 2025·Application pending·0 cites
- 0236US2023388363A1Information processing apparatus and control method thereof, and storage mediumCANON KK·Filed 2023·Application pending·0 cites
- 0335US2003148107A1Halogen-free nonflammable epoxy resin composition, halogen-free nonfammable epoxy resin composition for build-up type multi-layer board, prepreg, copper-clad laminate, printed wiring board, copper foil-attached resin film, carrier-attached resin film, build-up type laminate, and build-up type multi-layer boardKYOCERA CHEM CORP·Filed 2003·Application pending·0 cites
- 0433USD827471SElevator control panelFUJITEC KK·Filed 2015·Granted Sep 4, 2018·3 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →