Inventor · disambiguated record
Keisuke Ohkubo
Also filed as: OHKUBO KEISUKE
2 granted patents·1 pending application·24 citations·filing 1989–2022
53Inventor score
Top patents by PatentIndex Score
3 records- 0174US4985275AMethod for producing a fused silica envelope for discharge lampUSHIO ELECTRIC INC·Filed 1989·Granted Jan 15, 1991·24 cites·4 claims
- 0251US2024395759A1Film-like adhesive for semiconductors, method for producing film-like adhesive for semiconductors, adhesive tape, method for producing semiconductor device, and semiconductor deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 0339US12451395B2Method for evaluating pickup performance, integrated dicing/die-bonding film, method for evaluating and selecting integrated dicing/die-bonding film, and method for manufacturing semiconductor deviceRESONAC CORP·Filed 2019·Granted Oct 21, 2025·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →