Inventor · disambiguated record
Kenji Ohsawa
Also filed as: OHSAWA KENJI
43 granted patents·7 pending applications·1,316 citations·filing 1981–2011
99Inventor score
Top patents by PatentIndex Score
50 records- 0197US6514847B1Method for making a semiconductor deviceSONY CORP·Filed 2000·Granted Feb 4, 2003·180 cites·5 claims
- 0289US7374104B2Memory cardSONY CORP·Filed 2005·Granted May 20, 2008·21 cites·19 claims
- 0388US4528064AMethod of making multilayer circuit boardSONY CORP·Filed 1981·Granted Jul 9, 1985·53 cites·8 claims
- 0487US4398975AConductive pasteSONY CORP·Filed 1981·Granted Aug 16, 1983·56 cites·10 claims
- 0586US6051450ALead frame, manufacturing method of a lead frame, semiconductor device, assembling method of a semiconductor device, and electronic apparatusSONY CORP·Filed 1998·Granted Apr 18, 2000·72 cites·9 claims
- 0685US6351025B1Semiconductor chip having an underplate metal layerSONY CORP·Filed 2000·Granted Feb 26, 2002·22 cites·2 claims
- 0783US5945741ASemiconductor chip housing having a reinforcing plateSONY CORP·Filed 1997·Granted Aug 31, 1999·74 cites·12 claims
- 0882US8611089B2Heat pipe and circuit board with a heat pipe functionMIZUTA KEI·Filed 2009·Granted Dec 17, 2013·20 cites·16 claims
- 0982US8534348B2Heat pipe and method for manufacturing sameOHSAWA KENJI·Filed 2006·Granted Sep 17, 2013·12 cites·8 claims
- 1082US4435611AConductive pasteSONY CORP·Filed 1982·Granted Mar 6, 1984·33 cites·6 claims
- 1181US5723900AResin mold type semiconductor deviceSONY CORP·Filed 1997·Granted Mar 3, 1998·62 cites·16 claims
- 1280US6563202B1Lead frame, manufacturing method of a lead frame, semiconductor device, assembling method of a semiconductor device, and electronic apparatusSONY CORP·Filed 2000·Granted May 13, 2003·24 cites·11 claims
- 1380US5786239AMethod of manufacturing a semiconductor packageSONY CORP·Filed 1996·Granted Jul 28, 1998·51 cites·10 claims
- 1479US6093970ASemiconductor device and method for manufacturing the sameSONY CORP·Filed 1999·Granted Jul 25, 2000·56 cites·10 claims
- 1578US5886399ALead frame and integrated circuit packageSONY CORP·Filed 1996·Granted Mar 23, 1999·53 cites·15 claims
- 1678US4677252ACircuit boardSONY CORP·Filed 1986·Granted Jun 30, 1987·41 cites·6 claims
- 1777US5756377ALead frame and manufacturing method thereofSONY CORP·Filed 1996·Granted May 26, 1998·38 cites·3 claims
- 1875US6104091ASemiconductor package and the manufacturing methodSONY CORP·Filed 1998·Granted Aug 15, 2000·36 cites·5 claims
- 1973US8982559B2Heat sink, cooling module and coolable electronic boardOHSAWA KENJI·Filed 2009·Granted Mar 17, 2015·8 cites·7 claims
- 2073US5221428AProduction of lead frameSONY CORP·Filed 1991·Granted Jun 22, 1993·49 cites·6 claims
- 2171US6078097ALead frameSONY CORP·Filed 1997·Granted Jun 20, 2000·30 cites·8 claims
- 2269US6114755ASemiconductor package including chip housing, encapsulation and the manufacturing methodSONY CORP·Filed 1997·Granted Sep 5, 2000·28 cites·3 claims
- 2368US5349238ASemiconductor deviceSONY CORP·Filed 1992·Granted Sep 20, 1994·41 cites·6 claims
- 2467US6838368B1Method for making semiconductor device using a nickel film for stopping etchingSONY CORP·Filed 2000·Granted Jan 4, 2005·11 cites·5 claims
- 2566US5982033ASemiconductor chip packageSONY CORP·Filed 1997·Granted Nov 9, 1999·26 cites·2 claims
- 2665US6194778B1Semiconductor package with improved cross talk and grounding, and method of manufacturing sameSONY CORP·Filed 1997·Granted Feb 27, 2001·28 cites·8 claims
- 2764US6340840B1Lead frame and production method thereof, and semiconductor device and fabrication method thereofSONY CORP·Filed 2000·Granted Jan 22, 2002·10 cites·4 claims
- 2863US6258631B1Semiconductor package and the manufacturing methodSONY CORP·Filed 1999·Granted Jul 10, 2001·21 cites·4 claims
- 2960US6403402B1Semiconductor chip having an underplate metal layerSONY CORP·Filed 2000·Granted Jun 11, 2002·5 cites·1 claims
- 3059US6020626ASemiconductor deviceSONY CORP·Filed 1998·Granted Feb 1, 2000·25 cites·4 claims
- 3159US5481798AEtching method for forming a lead frameSONY CORP·Filed 1995·Granted Jan 9, 1996·26 cites·6 claims
- 3257US6074898ALead frame and integrated circuit packageSONY CORP·Filed 1999·Granted Jun 13, 2000·21 cites·15 claims
- 3356US6240632B1Method of manufacturing lead frame and integrated circuit packageSONY CORP·Filed 1996·Granted Jun 5, 2001·21 cites·9 claims
- 3456US2021310745A1Heat pipe and method for manufacturing sameOHSAWA KENJI·Filed 2007·Application pending·0 cites
- 3554US8988882B2Heat sink package and method of manufacturingOHSAWA KENJI·Filed 2010·Granted Mar 24, 2015·1 cites·5 claims
- 3653US6465279B2Lead frame and production method thereof, and semiconductor device and fabrication method thereofSONY CORP·Filed 2001·Granted Oct 15, 2002·4 cites·4 claims
- 3750US6369441B1Method of producing a semiconductor chip having an underplate metal layerSONY CORP·Filed 2000·Granted Apr 9, 2002·2 cites·1 claims
- 3850US6054773ASemiconductor device and method of manufacturing the sameSONY CORP·Filed 1998·Granted Apr 25, 2000·17 cites·8 claims
- 3950US2010189415A1Recording medium reproducing device and reproducing methodPIONEER CORP·Filed 2007·Application pending·0 cites
- 4047US2012211207A1Heat transporting unit and electronic deviceOHSAWA KENJI·Filed 2010·Application pending·0 cites
- 4146US6391684B2Lead frame and manufacturing method thereofSONY CORP·Filed 1999·Granted May 21, 2002·9 cites·20 claims
- 4246US6140153ALead frame, the manufacturing method, semiconductor device and the manufacturing methodSONY CORP·Filed 1998·Granted Oct 31, 2000·7 cites·7 claims
- 4346US5901436AMethod of manufacturing lead frameSONY CORP·Filed 1996·Granted May 11, 1999·13 cites·8 claims
- 4442US2008135214A1Heat Pipe and Method for Manufacturing SameFUCHIGAMI MICRO CO·Filed 2006·Application pending·0 cites
- 4539US2013269913A1Heat pipeUEDA SUSUMU·Filed 2007·Application pending·0 cites
- 4635US9240365B2Cooling device and electronic deviceOHSAWA KENJI·Filed 2010·Granted Jan 19, 2016·0 cites·18 claims
- 4734US5437764ALead frame and manufacturing method thereforSONY CORP·Filed 1994·Granted Aug 1, 1995·6 cites·7 claims
- 4832US5937278AMethod of manufacturing lead frame having inner lead connected to outer lead by metal etch stop layerSONY CORP·Filed 1996·Granted Aug 10, 1999·3 cites·8 claims
- 4929US2013126139A1Heat transporting unit, electronic circuit board and electronic deviceTSURUTA KATSUYA·Filed 2011·Application pending·0 cites
- 5029US2001005050A1Semiconductor device, method making the same, and electronic device using the sameFiled 1998·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →