Inventor · disambiguated record
Keisuke Okawara
Also filed as: OKAWARA Keisuke
0 granted patents·5 pending applications·0 citations·filing 2021–2023
Files withRESONAC CORP5
Top patents by PatentIndex Score
5 records- 0148US2025226347A1Adhesive film for semiconductors, dicing die bonding film, and method for producing semiconductor deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 0248US2025226348A1Adhesive film for semiconductors, dicing/die-bonding film, and method for manufacturing semiconductor deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 0344US2025006574A1Reinforced semiconductor chip production method, semiconductor chip with film, semiconductor chip reinforcement method, reinforcement film and semiconductor deviceRESONAC CORP·Filed 2021·Application pending·0 cites
- 0444US2024021443A1Curable resin film, film material for semiconductor device production, curable resin composition for semiconductor device production, and method for producing semiconductor deviceRESONAC CORP·Filed 2021·Application pending·0 cites
- 0541US2024006192A1Method for manufacturing semiconductor deviceRESONAC CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →