Inventor · disambiguated record
Kenzo Onizuka
Also filed as: ONIZUKA KENZO
3 granted patents·6 pending applications·10 citations·filing 2002–2022
62Inventor score
Top patents by PatentIndex Score
9 records- 0183US9574045B2Epoxy resin composition, epoxy resin, and cured productASAHI KASEI E MATERIALS CORP·Filed 2013·Granted Feb 21, 2017·4 cites·9 claims
- 0280US7858726B2Process for producing low-molecular polyphenylene etherASAHI KASEI CHEMICALS CORP·Filed 2007·Granted Dec 28, 2010·5 cites·11 claims
- 0375US11104760B2Thermosetting resin compositionASAHI CHEMICAL IND·Filed 2018·Granted Aug 31, 2021·1 cites·14 claims
- 0464US2024376291A1Epoxy resin composition, film, method for producing film, and cured productsASAHI CHEMICAL IND·Filed 2022·Application pending·0 cites
- 0552US2025034319A1Epoxy resin composition, cured product, encapsulant and adhesiveASAHI CHEMICAL IND·Filed 2022·Application pending·0 cites
- 0649US2024301176A1Epoxy resin composition, adhesive film, printed wiring board, semiconductor chip package, semiconductor device, and method for using adhesive filmASAHI CHEMICAL IND·Filed 2021·Application pending·0 cites
- 0741US2005031896A1Porous inorganic fine particlesFiled 2004·Application pending·0 cites
- 0834US2005020699A1Inorganic porous fine particlesFiled 2002·Application pending·0 cites
- 0933US2007093614A1Epoxy resin compositionASAHI KASEI CHEMICALS CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →