Inventor · disambiguated record
Keiyu Ou
Also filed as: OU Keiyu
8 granted patents·9 pending applications·5 citations·filing 2016–2021
74Inventor score
Files withFUJIFILM CORP17
Top patents by PatentIndex Score
17 records- 0185US10859914B2Pattern forming method, method for producing electronic device, and actinic ray-sensitive or radiation-sensitive resin composition for organic solvent developmentFUJIFILM CORP·Filed 2017·Granted Dec 8, 2020·3 cites·9 claims
- 0275US10025186B2Active-light-sensitive or radiation-sensitive resin composition, pattern forming method, and method for manufacturing electronic deviceFUJIFILM CORP·Filed 2017·Granted Jul 17, 2018·2 cites·12 claims
- 0360US2021271162A1Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic deviceFUJIFILM CORP·Filed 2021·Application pending·0 cites
- 0456US12216404B2Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic deviceFUJIFILM CORP·Filed 2020·Granted Feb 4, 2025·0 cites·5 claims
- 0554US12235579B2Method for producing actinic ray-sensitive or radiation-sensitive resin composition, pattern forming method, and method for manufacturing electronic deviceFUJIFILM CORP·Filed 2021·Granted Feb 25, 2025·0 cites·10 claims
- 0652US2021294217A1Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic deviceFUJIFILM CORP·Filed 2021·Application pending·0 cites
- 0749US9791777B2Active light sensitive or radiation sensitive resin composition, pattern forming method, method for manufacturing electronic device, and electronic deviceFUJIFILM CORP·Filed 2016·Granted Oct 17, 2017·0 cites·12 claims
- 0848US10649329B2Active light sensitive or radiation sensitive resin composition, active light sensitive or radiation sensitive film, pattern forming method, method for manufacturing electronic device, and electronic deviceFUJIFILM CORP·Filed 2016·Granted May 12, 2020·0 cites·17 claims
- 0947US11073762B2Actinic ray-sensitive or radiation sensitive resin composition, actinic raysensitive or radiation-sensitive film, pattern forming method, method for manufacturing electronic device, and photoacid generatorFUJIFILM CORP·Filed 2019·Granted Jul 27, 2021·0 cites·9 claims
- 1044US2019196326A1Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method of manufacturing electronic deviceFUJIFILM CORP·Filed 2019·Application pending·0 cites
- 1142US2018292751A1Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, pattern forming method, and method for manufacturing electronic deviceFUJIFILM CORP·Filed 2018·Application pending·0 cites
- 1239US2018120706A1Pattern forming method, laminate, and resist composition for organic solvent developmentFUJIFILM CORP·Filed 2017·Application pending·0 cites
- 1337US2017192355A1Method for forming negative tone pattern, method for manufacturing electronic device, and active-light-sensitive or radiation-sensitive resin compositionFUJIFILM CORP·Filed 2017·Application pending·0 cites
- 1437US2017199455A1Method for forming negative tone pattern, method for manufacturing electronic device, and active-light-sensitive or radiation-sensitive resin compositionFUJIFILM CORP·Filed 2017·Application pending·0 cites
- 1537US2017115571A1Pattern forming method and method for manufacturing electronic device using sameFUJIFILM CORP·Filed 2017·Application pending·0 cites
- 1636US9952509B2Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, method for manufacturing electronic device, and electronic deviceFUJIFILM CORP·Filed 2016·Granted Apr 24, 2018·0 cites·6 claims
- 1736US2016223905A1Active lightray-sensitive or radiation-sensitive resin composition and pattern forming methodFUJIFILM CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →