Inventor · disambiguated record
Kenji Oyachi
Also filed as: OYACHI KENJI
6 granted patents·193 citations·filing 1996–2016
83Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0187US6313540B1Electrode structure of semiconductor elementNEC CORP·Filed 1999·Granted Nov 6, 2001·108 cites·3 claims
- 0278US6166443ASemiconductor device with reduced thicknessNEC CORP·Filed 1999·Granted Dec 26, 2000·58 cites·12 claims
- 0364US9583455B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Feb 28, 2017·1 cites·8 claims
- 0462US9337134B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted May 10, 2016·1 cites·20 claims
- 0556US6265760B1Semiconductor device, and semiconductor device with die pad and protruding chip lead frame and method of manufacturing the sameNEC CORP·Filed 1999·Granted Jul 24, 2001·22 cites·10 claims
- 0630US5647527AMethod of determining order of wire-bondingNEC CORP·Filed 1996·Granted Jul 15, 1997·3 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →