Inventor · disambiguated record
Ken Pham
Also filed as: PHAM KEN
34 granted patents·6 pending applications·475 citations·filing 2000–2022
97Inventor score
Top patents by PatentIndex Score
40 records- 0194US7918378B1Wire bonding deflector for a wire bonderNAT SEMICONDUCTOR CORP·Filed 2010·Granted Apr 5, 2011·16 cites·16 claims
- 0294US7714418B2Leadframe panelNAT SEMICONDUCTOR CORP·Filed 2007·Granted May 11, 2010·64 cites·20 claims
- 0392US6989122B1Techniques for manufacturing flash-free contacts on a semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2002·Granted Jan 24, 2006·62 cites·3 claims
- 0488US6624507B1Miniature semiconductor package for opto-electronic devicesNAT SEMICONDUCTOR CORP·Filed 2001·Granted Sep 23, 2003·50 cites·19 claims
- 0588US6448632B1Metal coated markings on integrated circuit devicesNAT SEMICONDUCTOR CORP·Filed 2000·Granted Sep 10, 2002·49 cites·13 claims
- 0685US6802654B1Electrical connector for opto-electronic modulesNAT SEMICONDUCTOR CORP·Filed 2002·Granted Oct 12, 2004·33 cites·21 claims
- 0785US6595699B1Optoelectronic package with controlled fiber standoffNAT SEMICONDUCTOR CORP·Filed 2001·Granted Jul 22, 2003·40 cites·25 claims
- 0884US7045035B1Post singulation die separation apparatus and method for bulk feeding operationNAT SEMICONDUCTOR CORP·Filed 2005·Granted May 16, 2006·8 cites·15 claims
- 0984US6749345B1Apparatus and method for electro-optical packages that facilitate the coupling of optical cables to printed circuit boardsNAT SEMICONDUCTOR CORP·Filed 2002·Granted Jun 15, 2004·28 cites·30 claims
- 1082US6655854B1Optoelectronic package with dam structure to provide fiber standoffNAT SEMICONDUCTOR CORP·Filed 2001·Granted Dec 2, 2003·31 cites·34 claims
- 1179US6932136B1Post singulation die separation apparatus and method for bulk feeding operationNAT SEMICONDUCTOR CORP·Filed 2004·Granted Aug 23, 2005·19 cites·20 claims
- 1278US6642613B1Techniques for joining an opto-electronic module to a semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2001·Granted Nov 4, 2003·13 cites·22 claims
- 1376US10312184B2Semiconductor systems having premolded dual leadframesTEXAS INSTRUMENTS INC·Filed 2015·Granted Jun 4, 2019·2 cites·20 claims
- 1473US12482711B2Half bridge ceramic hermetic package structureTEXAS INSTRUMENTS INC·Filed 2022·Granted Nov 25, 2025·0 cites·20 claims
- 1573US7086788B2Optical sub-assembly for opto-electronic modulesNAT SEMICONDUCTOR CORP·Filed 2005·Granted Aug 8, 2006·5 cites·18 claims
- 1667US6628000B1Techniques for maintaining parallelism between optical and chip sub-assembliesNAT SEMICONDUCTOR CORP·Filed 2001·Granted Sep 30, 2003·10 cites·29 claims
- 1765US6916121B2Optical sub-assembly for optoelectronic modulesNAT SEMICONDUCTOR CORP·Filed 2002·Granted Jul 12, 2005·11 cites·32 claims
- 1864US7195955B2Technique for protecting photonic devices in optoelectronic packages with clear overmoldingNAT SEMICONDUCTOR CORP·Filed 2005·Granted Mar 27, 2007·2 cites·6 claims
- 1961US7247942B2Techniques for joining an opto-electronic module to a semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2004·Granted Jul 24, 2007·5 cites·20 claims
- 2059US12400939B2Packaged semiconductor device including heat slugTEXAS INSTRUMENTS INC·Filed 2021·Granted Aug 26, 2025·0 cites·34 claims
- 2158US6858468B2Techniques for joining an opto-electronic module to a semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2003·Granted Feb 22, 2005·4 cites·14 claims
- 2257US10573582B2Semiconductor systems having dual leadframesTEXAS INSTRUMENTS INC·Filed 2019·Granted Feb 25, 2020·0 cites·21 claims
- 2357US7001083B1Technique for protecting photonic devices in optoelectronic packages with clear overmoldingNAT SEMICONDUCTOR CORP·Filed 2001·Granted Feb 21, 2006·6 cites·27 claims
- 2457US6973225B2Techniques for attaching rotated photonic devices to an optical sub-assembly in an optoelectronic packageNAT SEMICONDUCTOR CORP·Filed 2002·Granted Dec 6, 2005·8 cites·19 claims
- 2555US7023705B2Ceramic optical sub-assembly for optoelectronic modulesNAT SEMICONDUCTOR CORP·Filed 2002·Granted Apr 4, 2006·5 cites·12 claims
- 2654US7199440B2Techniques for joining an opto-electronic module to a semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2004·Granted Apr 3, 2007·2 cites·20 claims
- 2752US6838317B2Techniques for joining an opto-electronic module to a semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2003·Granted Jan 4, 2005·2 cites·22 claims
- 2852US2023245942A1Semiconductor device package with integral heat slugTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 2951US11430719B2Spot-solderable leads for semiconductor device packagesTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 30, 2022·0 cites·6 claims
- 3051US11075147B2Stacked die semiconductor packageTEXAS INSTRUMENTS INC·Filed 2019·Granted Jul 27, 2021·0 cites·19 claims
- 3151US10607927B2Spot-solderable leads for semiconductor device packagesTEXAS INSTRUMENTS INC·Filed 2017·Granted Mar 31, 2020·0 cites·8 claims
- 3250US2022310302A1Integrated magnetic core and winding laminaTEXAS INSTRUMENTS INC·Filed 2021·Application pending·0 cites
- 3348US2010084748A1Thin foil for use in packaging integrated circuitsNAT SEMICONDUCTOR CORP·Filed 2009·Application pending·0 cites
- 3447US2006055080A1Semiconductor package having flash-free contacts and techniques for manufacturing the sameNAT SEMICONDUCTOR CORP·Filed 2005·Application pending·0 cites
- 3543US7269027B2Ceramic optical sub-assembly for optoelectronic modulesNAT SEMICONDUCTOR CORP·Filed 2006·Granted Sep 11, 2007·0 cites·20 claims
- 3642US8267303B2Wire bonding apparatus with a textured capillary surface enabling high-speed wedge bonding of wire bondsPHAM KEN·Filed 2011·Granted Sep 18, 2012·0 cites·17 claims
- 3741US2020135632A1Die isolation on a substrateTEXAS INSTRUMENTS INC·Filed 2018·Application pending·0 cites
- 3837US8283760B1Lead frame interconnect scheme with high power densityPHAM KEN·Filed 2010·Granted Oct 9, 2012·0 cites·11 claims
- 3935US6730170B1Encapsulant material applicator for semiconductor wafers and method of use thereofNAT SEMICONDUCTOR CORP·Filed 2000·Granted May 4, 2004·0 cites·12 claims
- 4034US2012032354A1Wirebonding method and device enabling high-speed reverse wedge bonding of wire bondsPHAM KEN·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Ken Pham files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →