Inventor · disambiguated record
Ken Sakamoto
Also filed as: SAKAMOTO KEN · SAKAMOTO KEN ICHI
34 granted patents·7 pending applications·880 citations·filing 1988–2023
96Inventor score
Files withMITSUBISHI ELECTRIC CORP20MATSUSHITA ELECTRIC INDUSTRIAL CO LTD8SAKAMOTO KEN4MAZDA MOTOR3ASICS CORP2
Top patents by PatentIndex Score
41 records- 0198US5390027ATelevision program recording and reproducing system using program data of text broadcast signalMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Feb 14, 1995·323 cites·7 claims
- 0297US5260788AText broadcast receiverMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1991·Granted Nov 9, 1993·163 cites·5 claims
- 0395US5552833ATransmission system and receiver using teletext information for programming video recorderMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1991·Granted Sep 3, 1996·233 cites·7 claims
- 0486US4992782ACharacter and graphics data display apparatus having data compression capabilityMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1988·Granted Feb 12, 1991·68 cites·10 claims
- 0579US9716072B2Power semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Jul 25, 2017·5 cites·11 claims
- 0678US11680174B1Coating composition, coating film forming method, and engine componentMAZDA MOTOR·Filed 2023·Granted Jun 20, 2023·0 cites·20 claims
- 0778US10431528B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Oct 1, 2019·3 cites·8 claims
- 0872US5365276AMultiscreen display circuit for displaying video signal sources having different aspect ratiosMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1992·Granted Nov 15, 1994·41 cites·6 claims
- 0971US11107746B2Power semiconductor apparatus and manufacturing method thereforMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Aug 31, 2021·2 cites·19 claims
- 1068US8441122B2Semiconductor device having semiconductor chip and metal plateFUKUOKA DAISUKE·Filed 2010·Granted May 14, 2013·3 cites·3 claims
- 1166US11931769B2Method of applying heat shield material to pistonMAZDA MOTOR·Filed 2022·Granted Mar 19, 2024·0 cites·16 claims
- 1265US8518751B2Method for manufacturing semiconductor device including removing a resin burrSAKAMOTO KEN·Filed 2011·Granted Aug 27, 2013·2 cites·5 claims
- 1359US10930523B2Method for manufacturing resin-sealed power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Feb 23, 2021·1 cites·7 claims
- 1459US9466548B2Semiconductor device and method of manufacturing semiconductor deviceSAKAMOTO KEN·Filed 2012·Granted Oct 11, 2016·1 cites·20 claims
- 1558US11387173B2Method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Jul 12, 2022·0 cites·4 claims
- 1657US12211764B2Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Jan 28, 2025·0 cites·8 claims
- 1754US10541193B2Lead frame and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Jan 21, 2020·0 cites·5 claims
- 1853US12224220B2Semiconductor module and power conversion apparatusMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Feb 11, 2025·0 cites·13 claims
- 1952USD746180SMotorcycle and / or replica thereofHONDA MOTOR CO LTD·Filed 2014·Granted Dec 29, 2015·10 cites·1 claims
- 2050US10043680B2Method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Aug 7, 2018·0 cites·9 claims
- 2147US11062916B2Method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jul 13, 2021·0 cites·14 claims
- 2247US2024266194A1Semiconductor manufacturing apparatus and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 2346US12512394B2Semiconductor device and power converterMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Dec 30, 2025·0 cites·20 claims
- 2446US2022415735A1Power module and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 2545US8859338B2Method of manufacturing a semiconductor device and semiconductor deviceSAKAMOTO KEN·Filed 2013·Granted Oct 14, 2014·0 cites·10 claims
- 2645US2023104534A1Method of applying heat shield material to pistonMAZDA MOTOR·Filed 2022·Application pending·0 cites
- 2744US9978662B2Semiconductor device and manufacturing method for sameMITSUBISHI ELECTRIC CORP·Filed 2013·Granted May 22, 2018·0 cites·6 claims
- 2842US11855033B2Power semiconductor module and power converterMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Dec 26, 2023·0 cites·15 claims
- 2942US9947613B2Power semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Apr 17, 2018·0 cites·3 claims
- 3042US5138450AHigh density character and/or figure displaying apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1990·Granted Aug 11, 1992·10 cites·4 claims
- 3142US2022336402A1Semiconductor device, power conversion device, and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Application pending·0 cites
- 3242US2018199666A1Shoe having shoe sole with divided forefoot portionASICS CORP·Filed 2015·Application pending·0 cites
- 3342US2019000180A1Shoe having shoe sole with divided rear foot portionASICS CORP·Filed 2015·Application pending·0 cites
- 3440US10490422B2Manufacturing method for semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Nov 26, 2019·0 cites·16 claims
- 3540US8334176B2Method of manufacturing semiconductor deviceSAKAMOTO KEN·Filed 2011·Granted Dec 18, 2012·0 cites·8 claims
- 3640US5010406AApparatus for receiving character multiplex broadcastingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1989·Granted Apr 23, 1991·7 cites·3 claims
- 3737US2019371625A1Semiconductor device and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Application pending·0 cites
- 3836US10074598B2Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Sep 11, 2018·0 cites·14 claims
- 3936USD694155SMotorcycle or motorcycle replicaHONDA MOTOR CO LTD·Filed 2012·Granted Nov 26, 2013·2 cites·1 claims
- 4035US5185598ACharacter graphic information display deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1990·Granted Feb 9, 1993·5 cites·5 claims
- 4125US5011975ANovel (trans 1-propenyl)disulfide derivative and process for preparing the sameNIPPON MIKTRON LIMITED·Filed 1989·Granted Apr 30, 1991·1 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →