Inventor · disambiguated record
Keizo Sakurai
Also filed as: SAKURAI KEIZO
5 granted patents·234 citations·filing 1990–2002
85Inventor score
Top patents by PatentIndex Score
5 records- 0194US5060843AProcess of forming bump on electrode of semiconductor chip and apparatus used thereforNEC CORP·Filed 1990·Granted Oct 29, 1991·103 cites·3 claims
- 0286US7021521B2Bump connection and method and apparatus for forming said connectionIBM·Filed 2002·Granted Apr 4, 2006·41 cites·14 claims
- 0381US6455785B1Bump connection with stacked metal ballsIBM·Filed 1999·Granted Sep 24, 2002·57 cites·9 claims
- 0453US6184479B1Multilayer printed circuit board having a concave metal portionIBM·Filed 1996·Granted Feb 6, 2001·21 cites·4 claims
- 0543US6105243AMethod of fabricating multilayer printed circuit boardIBM·Filed 1999·Granted Aug 22, 2000·12 cites·2 claims
Join the waitlist — get patent alerts
Get an alert when Keizo Sakurai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →