Inventor · disambiguated record
Keiichi Sasaki
Also filed as: SASAKI KEIICHI
55 granted patents·7 pending applications·1,217 citations·filing 1980–2021
98Inventor score
Top patents by PatentIndex Score
62 records- 0199US6809421B1Multichip semiconductor device, chip therefor and method of formation thereofTOSHIBA KK·Filed 1999·Granted Oct 26, 2004·496 cites·16 claims
- 0294US7829975B2Multichip semiconductor device, chip therefor and method of formation thereofTOSHIBA KK·Filed 2007·Granted Nov 9, 2010·23 cites·5 claims
- 0394US6624506B2Multichip semiconductor device and memory cardTOSHIBA KK·Filed 2001·Granted Sep 23, 2003·90 cites·25 claims
- 0493US8283755B2Multichip semiconductor device, chip therefor and method of formation thereofHAYASAKA NOBUO·Filed 2011·Granted Oct 9, 2012·15 cites·8 claims
- 0591US7711217B2Active sensor, multipoint active sensor, method for diagnosing deterioration of pipe, and apparatus for diagnosing deterioration of pipe, and apparatus for diagnosis deterioration of pipeTOSHIBA KK·Filed 2008·Granted May 4, 2010·46 cites·19 claims
- 0690US8174093B2Multichip semiconductor device, chip therefor and method of formation thereofHAYASAKA NOBUO·Filed 2010·Granted May 8, 2012·10 cites·16 claims
- 0787US5861675ASemiconductor device having WNF film and method of manufacturing such a deviceTOSHIBA KK·Filed 1997·Granted Jan 19, 1999·86 cites·23 claims
- 0886US6709966B1Semiconductor device, its manufacturing process, position matching mark, pattern forming method and pattern forming deviceTOSHIBA KK·Filed 2000·Granted Mar 23, 2004·38 cites·8 claims
- 0986US6235624B1Paste connection plug, burying method, and semiconductor device manufacturing methodTOSHIBA KK·Filed 1999·Granted May 22, 2001·59 cites·8 claims
- 1084US6841469B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2002·Granted Jan 11, 2005·48 cites·8 claims
- 1179US7082384B2Maintenance support method, storage medium, and maintenance support apparatusTOSHIBA KK·Filed 2004·Granted Jul 25, 2006·25 cites·12 claims
- 1278US7335517B2Multichip semiconductor device, chip therefor and method of formation thereofTOSHIBA KK·Filed 2004·Granted Feb 26, 2008·17 cites·13 claims
- 1376US6930382B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2004·Granted Aug 16, 2005·29 cites·20 claims
- 1475US6838351B2Manufacturing method of circuit board, circuit board, and liquid discharging apparatusCANON KK·Filed 2004·Granted Jan 4, 2005·10 cites·9 claims
- 1574US5446841AMulti-processor system having shared memory for storing the communication information used in communicating between processorsHITACHI LTD·Filed 1992·Granted Aug 29, 1995·73 cites·6 claims
- 1671US11465417B2Liquid discharge head substrate, method of manufacturing the same, liquid discharge head, and liquid discharge apparatusCANON KK·Filed 2020·Granted Oct 11, 2022·0 cites·20 claims
- 1771US9073318B2Method of manufacturing liquid discharge headCANON KK·Filed 2014·Granted Jul 7, 2015·1 cites·13 claims
- 1871US6538323B1Semiconductor device having an electrode structure comprising a conductive fine particle filmTOSHIBA KK·Filed 1999·Granted Mar 25, 2003·30 cites·15 claims
- 1970US10809232B2Optical fiber electromagnetic acoustic transducer pipe inspecting appartus and methodTOSHIBA KK·Filed 2015·Granted Oct 20, 2020·1 cites·10 claims
- 2070US10064979B2Bone regeneration materialUNIV TOHOKU·Filed 2014·Granted Sep 4, 2018·3 cites·8 claims
- 2170US8744223B2Array-type photo moduleYAMASHITA YUTO·Filed 2012·Granted Jun 3, 2014·4 cites·6 claims
- 2269US8409452B2Through-hole forming method, inkjet head, and silicon substrateSASAKI KEIICHI·Filed 2008·Granted Apr 2, 2013·3 cites·12 claims
- 2366US10899129B2Liquid discharge head substrate, method of manufacturing the same, liquid discharge head, and liquid discharge apparatusCANON KK·Filed 2018·Granted Jan 26, 2021·0 cites·16 claims
- 2466USD888712SWireless communication deviceYOKOGAWA ELECTRIC CORP·Filed 2019·Granted Jun 30, 2020·10 cites·1 claims
- 2566US8771528B2Through-hole forming method and inkjet headCANON KK·Filed 2013·Granted Jul 8, 2014·1 cites·15 claims
- 2666US6542836B1Waveform signal analyzerTOSHIBA KK·Filed 2000·Granted Apr 1, 2003·12 cites·18 claims
- 2765US6376894B1Semiconductor deviceTOSHIBA KK·Filed 2000·Granted Apr 23, 2002·12 cites·8 claims
- 2865US2020180287A1Resin composition for foamable laminate, foamable laminate, method for producing the same, and foamed converted paper and heat insulating container using the samePOLYETHYLENE CORP·Filed 2020·Application pending·0 cites
- 2964US6657306B1Paste including a mixture of powders, connection plug, burying method, and semiconductor device manufacturing methodTOSHIBA KK·Filed 2000·Granted Dec 2, 2003·7 cites·18 claims
- 3064US4402824AProcess for refining coal-based heavy oilsSUMITOMO METAL IND·Filed 1981·Granted Sep 6, 1983·17 cites·9 claims
- 3160US11031963B2Module connection structure and measuring instrumentYOKOGAWA ELECTRIC CORP·Filed 2019·Granted Jun 8, 2021·1 cites·14 claims
- 3260US7090339B2Liquid discharge head and method of manufacturing the sameCANON KK·Filed 2005·Granted Aug 15, 2006·1 cites·4 claims
- 3359US11009377B2Measuring apparatusYOKOGAWA ELECTRIC CORP·Filed 2018·Granted May 18, 2021·0 cites·12 claims
- 3459US2017361586A1Resin composition for foamable laminate, foamable laminate, method for producing the same, and foamed converted paper and heat insulating container using the sameJAPAN POLYETHYLENE CORP·Filed 2015·Application pending·0 cites
- 3555USD305894SForklift tractorKUBOTA LTD·Filed 1986·Granted Feb 6, 1990·7 cites·1 claims
- 3654US10777596B2Imaging apparatus, method of manufacturing the same, and deviceCANON KK·Filed 2018·Granted Sep 15, 2020·0 cites·20 claims
- 3754US7049223B2Paste including a mixture of powders, connection plug, burying method, and semiconductor device manufacturing methodTOSHIBA KK·Filed 2003·Granted May 23, 2006·3 cites·5 claims
- 3853US7270398B2Circuit board and liquid discharging apparatusCANON KK·Filed 2004·Granted Sep 18, 2007·2 cites·3 claims
- 3953US6978226B2Deterioration diagnostic method and equipment thereofTOSHIBA KK·Filed 2001·Granted Dec 20, 2005·6 cites·50 claims
- 4052USD888713SWireless communication deviceYOKOGAWA ELECTRIC CORP·Filed 2019·Granted Jun 30, 2020·5 cites·1 claims
- 4152US10573158B2Radio equipmentYOKOGAWA ELECTRIC CORP·Filed 2018·Granted Feb 25, 2020·0 cites·10 claims
- 4250US11652271B2Substrate storage structureYOKOGAWA ELECTRIC CORP·Filed 2021·Granted May 16, 2023·0 cites·9 claims
- 4349US6933216B2Fine particle film forming apparatus and method and semiconductor device and manufacturing method for the sameTOSHIBA KK·Filed 2002·Granted Aug 23, 2005·2 cites·7 claims
- 4448USD865551SWireless sensor deviceYOKOGAWA ELECTRIC CORP·Filed 2018·Granted Nov 5, 2019·4 cites·1 claims
- 4548US6751577B2Degradation diagnostic method, degradation diagnostic mediation device and degradation diagnostic device and computer-readable recording medium on which a program is recordedTOSHIBA KK·Filed 2001·Granted Jun 15, 2004·5 cites·27 claims
- 4648US2022202543A1Dental impression trayG C DENTAL IND CORP·Filed 2020·Application pending·0 cites
- 4747US7244370B2Method for producing circuit substrateCANON KK·Filed 2004·Granted Jul 17, 2007·4 cites·12 claims
- 4847US2005124164A1Fine particle film forming apparatus and method and semiconductor device and manufacturing method for the sameTOSHIBA KK·Filed 2005·Application pending·0 cites
- 4945US9451692B2Print element substrate, method of manufacturing the same, printhead and printing apparatusCANON KK·Filed 2014·Granted Sep 20, 2016·0 cites·19 claims
- 5045US2019358001A1Dental tray systemG C DENTAL IND CORP·Filed 2017·Application pending·0 cites
Showing the top 50 of 62 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →