Inventor · disambiguated record
Kevin Shawne Schneider
Also filed as: SCHNEIDER KEVIN · SCHNEIDER KEVIN S · SCHNEIDER KEVIN SHAWNE
13 granted patents·5 pending applications·58 citations·filing 2009–2022
89Inventor score
Top patents by PatentIndex Score
18 records- 0195US8686429B2LED structure with enhanced mirror reflectivityBERGMANN MICHAEL·Filed 2011·Granted Apr 1, 2014·25 cites·30 claims
- 0286US11289378B2Methods for dicing semiconductor wafers and semiconductor devices made by the methodsCREE INC·Filed 2019·Granted Mar 29, 2022·4 cites·23 claims
- 0383US9443903B2Low temperature high strength metal stack for die attachmentBERGMANN MICHAEL JOHN·Filed 2012·Granted Sep 13, 2016·7 cites·34 claims
- 0474US8216867B2Front end scribing of light emitting diode (LED) wafers and resulting devicesDONOFRIO MATTHEW·Filed 2009·Granted Jul 10, 2012·6 cites·16 claims
- 0572US10741741B2Multi header for thermoelectric devicePHONONIC INC·Filed 2017·Granted Aug 11, 2020·1 cites·25 claims
- 0666US12051669B2Contact and die attach metallization for silicon carbide based devices and related methods of sputtering eutectic alloysWOLFSPEED INC·Filed 2021·Granted Jul 30, 2024·0 cites·33 claims
- 0763US9496458B2Semiconductor light emitting diodes with crack-tolerant barrier structures and methods of fabricating the sameCREE INC·Filed 2013·Granted Nov 15, 2016·1 cites·25 claims
- 0861US10429030B2Hybrid lens system incorporating total internal reflection lens and diffuserLEDENGIN INC·Filed 2014·Granted Oct 1, 2019·1 cites·20 claims
- 0959US2014261627A1Power augmentation in concentrator photovoltaic modules by collection of diffuse lightSEMPRIUS INC·Filed 2014·Application pending·0 cites
- 1054US11152325B2Contact and die attach metallization for silicon carbide based devices and related methods of sputtering eutectic alloysCREE INC·Filed 2019·Granted Oct 19, 2021·0 cites·17 claims
- 1153USD672731SLight emitting diodeBERGMANN MICHAEL·Filed 2011·Granted Dec 18, 2012·8 cites·1 claims
- 1252US2014217435A1Light Emitting Diodes with Low Junction Temperature and Solid State Backlight Components Including Light Emitting Diodes with Low Junction TemperatureCREE INC·Filed 2014·Application pending·0 cites
- 1351US2023253359A1Semiconductor die including a metal stackWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 1451US2014167065A1Led structure with enhanced mirror reflectivityCREE INC·Filed 2014·Application pending·0 cites
- 1549US8698184B2Light emitting diodes with low junction temperature and solid state backlight components including light emitting diodes with low junction temperatureBERGMANN MICHAEL JOHN·Filed 2011·Granted Apr 15, 2014·0 cites·41 claims
- 1647USD689830SLight emitting diodeBERGMANN MICHAEL·Filed 2011·Granted Sep 17, 2013·5 cites·1 claims
- 1738US2018261748A1Thermoelectric heat pump cascade using multiple printed circuit boards with thermoelectric modulesPHONONIC INC·Filed 2018·Application pending·0 cites
- 1830USD675581SLight emitting diodeCREE INC·Filed 2011·Granted Feb 5, 2013·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →