Inventor · disambiguated record
Keiichi Sekiguchi
Also filed as: SEKIGUCHI KEIICHI
19 granted patents·2 pending applications·58 citations·filing 2003–2019
91Inventor score
Files withKYOCERA CORP8SEKIGUCHI KEIICHI5SEMICONDUCTOR ENERGY LAB4SANKEN ELECTRIC CO LTD3NAKAMURA KIYOTAKA1
Top patents by PatentIndex Score
21 records- 0190US7705358B2Semiconductor device and method of manufacturing the sameSEMICONDUCTOR ENERGY LAB·Filed 2007·Granted Apr 27, 2010·21 cites·6 claims
- 0272US7675120B2Integrated circuit having a multipurpose resistor for suppression of a parasitic transistor or other purposesSANKEN ELECTRIC CO LTD·Filed 2006·Granted Mar 9, 2010·6 cites·6 claims
- 0370US8166946B2Diesel engine start-up assisting deviceSEKIGUCHI KEIICHI·Filed 2010·Granted May 1, 2012·4 cites·5 claims
- 0465US7638372B2Semiconductor device and method for manufacturing the sameSEMICONDUCTOR ENERGY LAB·Filed 2006·Granted Dec 29, 2009·3 cites·16 claims
- 0563US8445338B2Semiconductor device and method for manufacturing the sameSEKIGUCHI KEIICHI·Filed 2012·Granted May 21, 2013·1 cites·26 claims
- 0661US7776681B2Semiconductor device and method for manufacturing the sameSEMICONDUCTOR ENERGY LAB·Filed 2009·Granted Aug 17, 2010·2 cites·16 claims
- 0760US7365361B2Semiconductor device and method for manufacturing the sameSEMICONDUCTOR ENERGY LAB·Filed 2004·Granted Apr 29, 2008·7 cites·13 claims
- 0860US7271579B2AC signal level detection circuitSANKEN ELECTRIC CO LTD·Filed 2003·Granted Sep 18, 2007·9 cites·8 claims
- 0959US10627173B2Flow path member, and heat exchanger and semiconductor manufacturing apparatus using sameKYOCERA CORP·Filed 2013·Granted Apr 21, 2020·1 cites·10 claims
- 1058US8936999B2Manufacturing method of SOI substrateSEKIGUCHI KEIICHI·Filed 2011·Granted Jan 20, 2015·1 cites·12 claims
- 1156US7990674B2Load drive apparatusSANKEN ELECTRIC CO LTD·Filed 2007·Granted Aug 2, 2011·3 cites·5 claims
- 1255US10697707B2Heat exchange member and heat exchangerKYOCERA CORP·Filed 2014·Granted Jun 30, 2020·0 cites·14 claims
- 1353US11472748B2Manufacturing method for a member for a semiconductor manufacturing device and member for a semiconductor manufacturing deviceKYOCERA CORP·Filed 2019·Granted Oct 18, 2022·0 cites·7 claims
- 1452US8236633B2Semiconductor device and method for manufacturing the sameSEKIGUCHI KEIICHI·Filed 2008·Granted Aug 7, 2012·0 cites·12 claims
- 1549US2015153116A1Flow path member, and heat exchanger and semiconductor manufacturing device using sameKYOCERA CORP·Filed 2013·Application pending·0 cites
- 1644US10103047B2Flow path member, heat exchanger including the flow path member, and semiconductor manufacturing apparatus including the flow path memberKYOCERA CORP·Filed 2013·Granted Oct 16, 2018·0 cites·9 claims
- 1741US11961747B2Heater and heater systemKYOCERA CORP·Filed 2019·Granted Apr 16, 2024·0 cites·12 claims
- 1841US9953898B2Flow channel member, and heat exchanger and semiconductor module each using sameKYOCERA CORP·Filed 2015·Granted Apr 24, 2018·0 cites·7 claims
- 1938US2017219302A1Heat exchangerKYOCERA CORP·Filed 2015·Application pending·0 cites
- 2037US8445358B2Method for manufacturing semiconductor substrate and method for manufacturing semiconductor deviceSEKIGUCHI KEIICHI·Filed 2011·Granted May 21, 2013·0 cites·9 claims
- 2132US9820379B2Circuit board and electronic device including sameNAKAMURA KIYOTAKA·Filed 2012·Granted Nov 14, 2017·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →