Inventor · disambiguated record
Kenichi Shirasaka
Also filed as: SHIRASAKA KENICHI
22 granted patents·15 pending applications·213 citations·filing 2002–2009
95Inventor score
Top patents by PatentIndex Score
37 records- 0197US7290448B2Physical quantity sensor, lead frame, and manufacturing method thereforYAMAHA CORP·Filed 2005·Granted Nov 6, 2007·50 cites·11 claims
- 0295US7595548B2Physical quantity sensor and manufacturing method thereforYAMAHA CORP·Filed 2005·Granted Sep 29, 2009·39 cites·1 claims
- 0392US7397112B2Semiconductor package and lead frame thereforYAMAHA CORP·Filed 2005·Granted Jul 8, 2008·26 cites·19 claims
- 0484US7607355B2Semiconductor deviceYAMAHA CORP·Filed 2008·Granted Oct 27, 2009·13 cites·11 claims
- 0581US7541294B2Semiconductor package and semiconductor package mounting methodYAMAHA CORP·Filed 2005·Granted Jun 2, 2009·7 cites·6 claims
- 0678US7170149B2Semiconductor device and package, and method of manufacture thereforYAMAHA CORP·Filed 2002·Granted Jan 30, 2007·22 cites·13 claims
- 0777US7554182B2Semiconductor device and package, and method of manufacturer thereforYAMAHA CORP·Filed 2006·Granted Jun 30, 2009·6 cites·9 claims
- 0874US7541665B2Lead frame for a magnetic sensorYAMAHA CORP·Filed 2006·Granted Jun 2, 2009·4 cites·3 claims
- 0971US7829982B2Lead frame, sensor including lead frame and method of forming sensor including lead frameYAMAHA CORP·Filed 2006·Granted Nov 9, 2010·5 cites·11 claims
- 1071US7791180B2Physical quantity sensor and lead frame used for sameYAMAHA CORP·Filed 2005·Granted Sep 7, 2010·5 cites·15 claims
- 1171US7187063B2Manufacturing method for magnetic sensor and lead frame thereforYAMAHA CORP·Filed 2003·Granted Mar 6, 2007·12 cites·13 claims
- 1271US6979910B2Semiconductor package and semiconductor package mounting methodYAMAHA CORP·Filed 2003·Granted Dec 27, 2005·12 cites·6 claims
- 1366US7494838B2Manufacturing method for magnetic sensor and lead frame thereforYAMAHA CORP·Filed 2006·Granted Feb 24, 2009·2 cites·15 claims
- 1464US7727793B2Physical quantity sensor and manufacturing method thereforYAMAHA CORP·Filed 2006·Granted Jun 1, 2010·2 cites·17 claims
- 1562US7754130B2Method for manufacturing physical quantity sensorYAMAHA CORP·Filed 2007·Granted Jul 13, 2010·2 cites·6 claims
- 1662US2007264756A1Method and apparatus for manufacture and inspection of semiconductor deviceYAMAHA CORP·Filed 2007·Application pending·0 cites
- 1758US7964942B2Lead frame having a die stage smaller than a semiconductor device and a semiconductor device using the sameYAMAHA CORP·Filed 2007·Granted Jun 21, 2011·1 cites·9 claims
- 1855US7319042B2Method and apparatus for manufacture and inspection of semiconductor deviceYAMAHA CORP·Filed 2002·Granted Jan 15, 2008·1 cites·4 claims
- 1952US2007292994A1Method of manufacturing a semiconductor package using a lead frame having through holes or hollows thereinYAMAHA CORP·Filed 2007·Application pending·0 cites
- 2051US7195953B2Method of manufacturing a semiconductor package using a lead frame having through holes or hollows thereinYAMAHA CORP·Filed 2004·Granted Mar 27, 2007·3 cites·3 claims
- 2151US2007126089A1Method of manufacturing a semiconductor package using lead frame having through holes or hollows thereinYAMAHA CORP·Filed 2007·Application pending·0 cites
- 2250US7867827B2Physical quantity sensor, lead frame, and manufacturing method thereforYAMAHA CORP·Filed 2007·Granted Jan 11, 2011·0 cites·6 claims
- 2350US2006228833A1Method of manufacturing a semiconductor package using a lead frame having through holes or hollows thereinSHIRASAKA KENICHI·Filed 2006·Application pending·0 cites
- 2448US8138757B2Manufacturing method for magnetic sensor and lead frame thereforADACHI HIROSHI·Filed 2005·Granted Mar 20, 2012·0 cites·4 claims
- 2548US2006278027A1Physical quantity sensor, lead frame, and manufacturing method thereforYAMAHA CORP·Filed 2006·Application pending·0 cites
- 2648US2008310663A1Microphone package adapted to semiconductor device and manufacturing method thereforYAMAHA CORP·Filed 2008·Application pending·0 cites
- 2747US2009243058A1Lead frame and package of semiconductor deviceYAMAHA CORP·Filed 2009·Application pending·0 cites
- 2846US6861282B2Semiconductor package and semiconductor package mounting methodYAMAHA CORP·Filed 2002·Granted Mar 1, 2005·1 cites·5 claims
- 2946US2009065882A1Semiconductor device, lead frame, and microphone package thereforYAMAHA CORP·Filed 2008·Application pending·0 cites
- 3046US2009175479A1Microphone package, lead frame, mold substrate, and mounting structure thereforYAMAHA CORP·Filed 2009·Application pending·0 cites
- 3145US2008191325A1Semiconductor device and packaging structure thereforYAMAHA CORP·Filed 2008·Application pending·0 cites
- 3244US7524696B2Sensor including lead frame and method of forming sensor including lead frameYAMAHA CORP·Filed 2006·Granted Apr 28, 2009·0 cites·23 claims
- 3342US2004209397A1Semiconductor package for improved recognition and mountingFiled 2004·Application pending·0 cites
- 3442US2006211176A1Manufacturing method for physical quantity sensor using lead frame and bonding device thereforSHIGA INTERNAT·Filed 2006·Application pending·0 cites
- 3540US2006185452A1Lead frame, sensor including lead frame, resin composition to be used for resin mold in the sensor, and sensor including the resin moldYAMAHA CORP·Filed 2006·Application pending·0 cites
- 3634US2005006733A1Lead frame and semiconductor device using the sameFiled 2004·Application pending·0 cites
- 3732US2006071307A1Lead frame and semiconductor package thereforYAMAHA CORP·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →