Inventor · disambiguated record
Keith G. Spanjer
Also filed as: SPANJER KEITH G · SPANJER KEITH GORDON
13 granted patents·487 citations·filing 1976–1989
94Inventor score
Files withMOTOROLA INC13
Top patents by PatentIndex Score
13 records- 0193US4170472ASolder systemMOTOROLA INC·Filed 1977·Granted Oct 9, 1979·55 cites·4 claims
- 0289US4753863ALaser markable molding compoundMOTOROLA INC·Filed 1986·Granted Jun 28, 1988·87 cites·6 claims
- 0386US4546374ASemiconductor device including plateless packageMOTOROLA INC·Filed 1984·Granted Oct 8, 1985·62 cites·11 claims
- 0485US4654290ALaser markable molding compound, method of use and device therefromMOTOROLA INC·Filed 1986·Granted Mar 31, 1987·67 cites·7 claims
- 0579US4631805ASemiconductor device including plateless package fabrication methodMOTOROLA INC·Filed 1985·Granted Dec 30, 1986·56 cites·22 claims
- 0677US4946518AMethod for improving the adhesion of a plastic encapsulant to copper containing leadframesMOTOROLA INC·Filed 1989·Granted Aug 7, 1990·34 cites·10 claims
- 0765US4583283AElectrically isolated semiconductor power deviceMOTOROLA INC·Filed 1985·Granted Apr 22, 1986·33 cites·8 claims
- 0864US4518982AHigh current package with multi-level leadsMOTOROLA INC·Filed 1983·Granted May 21, 1985·29 cites·15 claims
- 0960US4595647AMethod for encapsulating and marking electronic devicesMOTOROLA INC·Filed 1985·Granted Jun 17, 1986·25 cites·10 claims
- 1049US4627988AMethod for applying material to a semiconductor waferMOTOROLA INC·Filed 1985·Granted Dec 9, 1986·16 cites·15 claims
- 1145US4510519AElectrically isolated semiconductor power deviceMOTOROLA INC·Filed 1982·Granted Apr 9, 1985·12 cites·13 claims
- 1235US4589195AMethod of fabricating a high current package with multi-level leadsMOTOROLA INC·Filed 1985·Granted May 20, 1986·8 cites·5 claims
- 1332US4096521AProtective coating for high voltage devicesMOTOROLA INC·Filed 1976·Granted Jun 20, 1978·3 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →