Inventor · disambiguated record
Kesav Kumar Sridharan
Also filed as: SRIDHARAN KESAV KUMAR
2 granted patents·2 pending applications·0 citations·filing 2022–2023
23Inventor score
Top patents by PatentIndex Score
4 records- 0154US2024057246A1Through board via heat sinkAPTIV TECH LTD·Filed 2023·Application pending·0 cites
- 0253US12353258B2Sheet metal enclosure with an array of extruded heat transfer holesAptiv Technologies AG·Filed 2022·Granted Jul 8, 2025·0 cites·15 claims
- 0353US11825593B2Through board via heat sinkAPTIV TECH LTD·Filed 2022·Granted Nov 21, 2023·0 cites·16 claims
- 0448US2023408636A1Metalized plastic housing enclosure heat sinkAPTIV TECH LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →