Inventor · disambiguated record
Kenji Sugawara
Also filed as: SUGAWARA KENJI
22 granted patents·7 pending applications·293 citations·filing 1990–2022
95Inventor score
Files withSHINKAWA KK18MITSUBISHI MATERIALS CORP3SUGAWARA KENJI2TOPPAN PRINTING CO LTD2YAMAZAKI KAZUYA2
Top patents by PatentIndex Score
29 records- 0191US7182555B2Indexable insertMITSUBISHI MATERIALS CORP·Filed 2002·Granted Feb 27, 2007·47 cites·19 claims
- 0281US8127624B2Particulate sampling apparatus, particulate sampling substrate and particulate sampling methodHASHIMOTO GAKUJI·Filed 2008·Granted Mar 6, 2012·10 cites·10 claims
- 0379US7324684B2Bonding apparatusSHINKAWA KK·Filed 2006·Granted Jan 29, 2008·7 cites·2 claims
- 0477US6917699B2Image processing method, an image processing device and a bonding apparatusSHINKAWA KK·Filed 2002·Granted Jul 12, 2005·26 cites·8 claims
- 0575US8657540B2Cutting insertYAMAZAKI KAZUYA·Filed 2012·Granted Feb 25, 2014·4 cites·6 claims
- 0675US8585330B2Cutting insertYAMAZAKI KAZUYA·Filed 2009·Granted Nov 19, 2013·9 cites·16 claims
- 0772US5369492ABonding wire inspection apparatusSHINKAWA KK·Filed 1992·Granted Nov 29, 1994·46 cites·2 claims
- 0864US5394246ABonding wire inspection apparatus and methodSHINKAWA KK·Filed 1994·Granted Feb 28, 1995·33 cites·4 claims
- 0963US7013039B2Image processing method, an image processing device and a bonding apparatusSHINKAWA KK·Filed 2002·Granted Mar 14, 2006·11 cites·9 claims
- 1060US2024316652A1Clamp structure of cutting insert and indexable cutting toolMITSUBISHI MATERIALS CORP·Filed 2022·Application pending·0 cites
- 1158US6868176B2Image processing method and deviceSHINKAWA KK·Filed 2002·Granted Mar 15, 2005·12 cites·9 claims
- 1257US7209583B2Bonding method, bonding apparatus and bonding programSHINKAWA KK·Filed 2004·Granted Apr 24, 2007·6 cites·4 claims
- 1356US6961457B2Bonding apparatus and bonding methodSHINKAWA KK·Filed 2001·Granted Nov 1, 2005·7 cites·4 claims
- 1455US5396334ABonding wire inspection apparatusSHINKAWA KK·Filed 1992·Granted Mar 7, 1995·24 cites·1 claims
- 1555US2009280389A1Fuel Cell Separator and Manufacturing Method ThereofTOPPAN PRINTING CO LTD·Filed 2009·Application pending·0 cites
- 1654US10759749B2Therapeutic agent for diabetesJAPAN CHEM RES·Filed 2017·Granted Sep 1, 2020·0 cites·12 claims
- 1751US5365341ABonding wire inspection apparatusSHINKAWA KK·Filed 1992·Granted Nov 15, 1994·19 cites·1 claims
- 1850US7330582B2Bonding programSHINKAWA KK·Filed 2006·Granted Feb 12, 2008·0 cites·2 claims
- 1950US2008219784A1Cutting insertMITSUBISHI MATERIALS CORP·Filed 2008·Application pending·0 cites
- 2046US8091761B2Bonding apparatus and bonding methodSUGAWARA KENJI·Filed 2010·Granted Jan 10, 2012·1 cites·14 claims
- 2145US2010072262A1Wire bonding methodSHINKAWA KK·Filed 2008·Application pending·0 cites
- 2244US7929152B2Apparatus for detecting press-bonded ball at bonding portion in bonding apparatus and method for detecting press-bonded ball at bonding portionSHINKAWA KK·Filed 2008·Granted Apr 19, 2011·0 cites·16 claims
- 2344US5347362ABonding wire inspection methodSHINKAWA KK·Filed 1992·Granted Sep 13, 1994·14 cites·3 claims
- 2442US5078472ADriving device for an optical systemSHINKAWA KK·Filed 1990·Granted Jan 7, 1992·10 cites·2 claims
- 2541US2016204428A1Negative electrode for nonaqueous-electrolytic-solution secondary cells, nonaqueous-electrolytic-solution secondary cell, and method for fabricating negative electrode for nonaqueous-electrolytic-solution secondary cellsTOPPAN PRINTING CO LTD·Filed 2016·Application pending·0 cites
- 2636US5293217ABonding wire inspection apparatusSHINKAWA KK·Filed 1992·Granted Mar 8, 1994·7 cites·2 claims
- 2736US2002114520A1Position detection device and methodSHINKAWA KK·Filed 2001·Application pending·0 cites
- 2836US2002102016A1Image processing method and deviceSHINKAWA KK·Filed 2002·Application pending·0 cites
- 2932US8149276B2Pressure-bonded ball diameter detecting apparatus and pressure-bonded ball diameter detecting methodSUGAWARA KENJI·Filed 2010·Granted Apr 3, 2012·0 cites·2 claims
Join the waitlist — get patent alerts
Get an alert when Kenji Sugawara files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →