Inventor · disambiguated record
Kenya Tachibana
Also filed as: TACHIBANA KENYA
4 granted patents·5 pending applications·24 citations·filing 2007–2022
71Inventor score
Top patents by PatentIndex Score
9 records- 0180US7893542B2Connecting structure for flip-chip semiconductor package, build-up layer material, sealing resin composition, and circuit boardSUMITOMO BAKELITE CO·Filed 2008·Granted Feb 22, 2011·11 cites·11 claims
- 0268US8592994B2Semiconductor package, core layer material, buildup layer material, and sealing resin compositionTACHIBANA KENYA·Filed 2007·Granted Nov 26, 2013·6 cites·11 claims
- 0367US8008767B2Semiconductor deviceSUMITOMO BAKELIGHT CO LTD·Filed 2007·Granted Aug 30, 2011·7 cites·7 claims
- 0455US2025011264A1Cyclic compound and method for producing cyclic compoundSUMITOMO BAKELITE CO·Filed 2022·Application pending·0 cites
- 0552US2021236444A1Medicinal product, anticancer agent, medicinal intermediate product, and method for producing cyclic carboxylic acid compound or derivative thereofSUMITOMO BAKELITE CO·Filed 2019·Application pending·0 cites
- 0651US12295394B2Water-soluble additive compositionSUMITOMO BAKELITE CO·Filed 2020·Granted May 13, 2025·0 cites·8 claims
- 0737US2011180208A1Method for laminating prepreg, method for producing printed wiring board and prepreg rollTACHIBANA KENYA·Filed 2011·Application pending·0 cites
- 0835US2013058062A1Method for manufacturing base material having gold-plated metal fine pattern, base material having gold-plated metal fine pattern, printed wiring board, interposer, and semiconductor deviceTACHIBANA KENYA·Filed 2011·Application pending·0 cites
- 0933US2011051387A1Method for electroless nickel-palladium-gold plating, plated product, printed wiring board, interposer and semiconductor apparatusSUMITOMO BAKELITE CO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →