Inventor · disambiguated record
Keiji Takai
Also filed as: TAKAI KEIJI
6 granted patents·329 citations·filing 1996–2010
85Inventor score
Top patents by PatentIndex Score
6 records- 0191US5717252ASolder-ball connected semiconductor device with a recessed chip mounting areaMITSUI HIGH TEC·Filed 1996·Granted Feb 10, 1998·159 cites·9 claims
- 0287US5661086AProcess for manufacturing a plurality of strip lead frame semiconductor devicesMITSUI HIGH TEC·Filed 1996·Granted Aug 26, 1997·126 cites·10 claims
- 0370US6659385B2Wire-winding machine and a wire-winding method for making windings of a rotary electromechanical deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Dec 9, 2003·20 cites·12 claims
- 0460US8003444B2Semiconductor device and manufacturing method thereofMITSUI HIGH TEC·Filed 2006·Granted Aug 23, 2011·4 cites·16 claims
- 0557US8258608B2Lead frame and intermediate product of semiconductor deviceTAKAI KEIJI·Filed 2010·Granted Sep 4, 2012·2 cites·11 claims
- 0647US5614443AMethod of producing a frame made of connected semiconductor die mounting substratesMITSUI HIGH TEC·Filed 1996·Granted Mar 25, 1997·18 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →