Inventor · disambiguated record
Kenji Takayama
Also filed as: TAKAYAMA KENJI
8 granted patents·2 pending applications·40 citations·filing 1999–2016
82Inventor score
Files withMURATA MANUFACTURING CO2SUMITOMO BAKELITE CO2HANDA TAKANOBU1NISSIN KOGYO KK1PANASONIC IP MAN CO LTD1
Top patents by PatentIndex Score
10 records- 0173US9149654B2Radiotherapy device controller and method of measuring position of specific-partHANDA TAKANOBU·Filed 2010·Granted Oct 6, 2015·12 cites·20 claims
- 0265US9566979B2Vehicle braking system for stability controlNISSIN KOGYO KK·Filed 2014·Granted Feb 14, 2017·2 cites·20 claims
- 0361US8422631B2Radiation therapy planning apparatus and radiation therapy planning methodTAKAHASHI KUNIO·Filed 2008·Granted Apr 16, 2013·10 cites·25 claims
- 0453US6733901B2Process for production of epoxy resin composition for semiconductor encapsulation, epoxy resin composition for semiconductor encapsulation, and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2002·Granted May 11, 2004·7 cites·17 claims
- 0543US2016295710A1Electronic apparatus, motor vehicle equipped with electronic apparatus, display device, and mobile device equipped with display devicePANASONIC IP MAN CO LTD·Filed 2014·Application pending·0 cites
- 0642US8985569B2Document-sheet conveyance device and image forming apparatusTAKAYAMA KENJI·Filed 2014·Granted Mar 24, 2015·0 cites·4 claims
- 0736US2011188893A1Optical writing device and image forming apparatusRICOH CO LTD·Filed 2011·Application pending·0 cites
- 0835US10122366B2Crystal oscillation deviceMURATA MANUFACTURING CO·Filed 2016·Granted Nov 6, 2018·0 cites·18 claims
- 0935US6495260B1Method of producing epoxy for molding semiconductor device, molding material, and semiconductor deviceSUMITOMO BAKELITE CO·Filed 1999·Granted Dec 17, 2002·9 cites·8 claims
- 1031US10122342B2Crystal vibration deviceMURATA MANUFACTURING CO·Filed 2016·Granted Nov 6, 2018·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →