Inventor · disambiguated record
Kelvin Aik Boo Tan
Also filed as: TAN KELVIN AIK BOO
3 granted patents·14 pending applications·0 citations·filing 2022–2025
42Inventor score
Technology areasH10W
Files withMICRON TECHNOLOGY INC17
Top patents by PatentIndex Score
17 records- 0161US12500186B2Capacitor having electrodes formed within a substrateMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 16, 2025·0 cites·27 claims
- 0261US2025203773A1Semiconductor package and methods of formationMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0360US2025183227A1High-density semiconductor chip packageMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0458US12463140B2Flexible interposer for semiconductor diesMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 4, 2025·0 cites·35 claims
- 0557US2024282751A1Substrates with downsetMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0657US2024332216A1Molded compound patterns on package ball side to mitigate coplanarity and warpageMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0756US12476216B2Wire bonding for stacked memory diesMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 18, 2025·0 cites·17 claims
- 0856US2024203842A1Semiconductor device assembly with a circular segmented package edgeMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 0956US2024268132A1Legged support structure to mitigate stacked die overhang deflectionMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1055US2024194547A1Substrates for semiconductor packagesMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1155US2024162206A1Load switch mounting for a semiconductor packageMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1255US2024194630A1Bondable pillars for wire bonds in a semiconductor packageMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1355US2024162207A1Passive electronic components on a semiconductor dieMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1454US2024260281A1Molded memory assemblies for a system in package semiconductor device assemblyMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1550US2024063201A1Non-conductive film for bonding a flip chip die to a substrateMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 1647US2025285995A1Protective barrier for electrostatic discharge contact structureMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1745US2025266403A1Slanted die stacking to mitigate overhang deflectionMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Kelvin Aik Boo Tan files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →