Inventor · disambiguated record
Ke Yan Tean
Also filed as: TEAN KE YAN
9 granted patents·7 pending applications·12 citations·filing 2019–2025
81Inventor score
Technology areasH10W
Top patents by PatentIndex Score
16 records- 0194US11876028B2Package with electrically insulated carrier and at least one step on encapsulantINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 16, 2024·2 cites·20 claims
- 0290US11652078B2High voltage semiconductor package with pin fit leadsINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 16, 2023·3 cites·17 claims
- 0387US11621204B2Molded semiconductor module having a mold step for increasing creepage distanceINFINEON TECHNOLOGIES AG·Filed 2021·Granted Apr 4, 2023·3 cites·22 claims
- 0480US12094793B2Package with electrically insulated carrier and at least one step on encapsulantINFINEON TECHNOLOGIES AG·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 0579US11600547B2Semiconductor package with expanded heat spreaderINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Mar 7, 2023·3 cites·20 claims
- 0678US2024395646A1Package with electrically insulated carrier and at least one step on encapsulantINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0767US11069600B2Semiconductor package with space efficient lead and die pad designINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jul 20, 2021·1 cites·16 claims
- 0852US2024087992A1Chip package, chip system, method of forming a chip package, and method of forming a chip systemINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0950US2024387305A1Semiconductor package having a die pad and an encapsulation with trenches and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1049US11804424B2Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clipINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Oct 31, 2023·0 cites·20 claims
- 1148US12057376B2Three level interconnect clipINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 6, 2024·0 cites·17 claims
- 1248US2024234256A1Package with vacuum suction enhancing indentation on back side of carrierINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1348US2025293127A1Leadframe panel, a semiconductor package comprising a leadframe with a two-level dambar design and a method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 1446US11211353B2Clips for semiconductor packagesINFINEON TECHNOLOGIES AG·Filed 2019·Granted Dec 28, 2021·0 cites·24 claims
- 1538US2021043549A1Clips for semiconductor packagesINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 1634US2020294896A1Lead Frame Stabilizer for Improved Lead PlanarityINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →