Inventor · disambiguated record
Kenji Tokunaga
Also filed as: TOKUNAGA KENJI
22 granted patents·7 pending applications·642 citations·filing 1985–2025
95Inventor score
Files withHITACHI LTD5DENSO CORP3MITSUBISHI HEAVY IND LTD3MITSUBISHI MATERIALS CORP3RENESAS TECH CORP3
Top patents by PatentIndex Score
29 records- 0197US6867153B2Method of purging wafer receiving jig, wafer transfer device, and method of manufacturing semiconductor deviceTRECENTI TECHNOLOGIES INC·Filed 2004·Granted Mar 15, 2005·327 cites·14 claims
- 0293US7077173B2Wafer carrier, wafer conveying system, stocker, and method of replacing gasRENESAS TECH CORP·Filed 2002·Granted Jul 18, 2006·77 cites·4 claims
- 0392US6817822B2Load port, wafer processing apparatus, and method of replacing atmosphereSEMICONDUCTOR LEADING EDGE TEC·Filed 2002·Granted Nov 16, 2004·68 cites·2 claims
- 0490US6473996B1Load port system for substrate processing system, and method of processing substrateSEMICONDUCTOR LEADING EDGE TEC·Filed 2000·Granted Nov 5, 2002·54 cites·13 claims
- 0583US6688106B2Waste processing system and fuel reformer used in the waste processing systemHITACHI LTD·Filed 2001·Granted Feb 10, 2004·22 cites·5 claims
- 0681US2024295587A1Current sensorDENSO CORP·Filed 2024·Application pending·0 cites
- 0781US2024295588A1Current sensorDENSO CORP·Filed 2024·Application pending·0 cites
- 0875US2025347720A1Current sensorDENSO CORP·Filed 2025·Application pending·0 cites
- 0973US11117833B2Rapid-hardening mortar compositionMITSUBISHI MATERIALS CORP·Filed 2017·Granted Sep 14, 2021·1 cites·20 claims
- 1073US10800701B2Rapid-hardening cement compositionMITSUBISHI MATERIALS CORP·Filed 2017·Granted Oct 13, 2020·1 cites·20 claims
- 1170US7314345B2Semiconductor container opening/closing apparatus and semiconductor device manufacturing methodRENESAS TECH CORP·Filed 2006·Granted Jan 1, 2008·2 cites·5 claims
- 1262US7643302B2Electronic device, package having the same, and electronic apparatusFUJITSU LTD·Filed 2008·Granted Jan 5, 2010·2 cites·10 claims
- 1361US5127470AApparatus for heat recovery and method for operating the apparatusHITACHI LTD·Filed 1990·Granted Jul 7, 1992·22 cites·2 claims
- 1459US7048493B2Method of manufacturing a semiconductor integrated circuit device which prevents foreign particles from being drawn into a semiconductor container containing semiconductor wafersRENESAS TECH CORP·Filed 2004·Granted May 23, 2006·4 cites·3 claims
- 1559US4649780ACutting device for cutting an annular body into beltsBANDO CHEMICAL IND·Filed 1985·Granted Mar 17, 1987·17 cites·7 claims
- 1658US2010086392A1Semiconductor container opening/closing apparatus and semiconductor device manufacturing methodKOBAYASHI YOSHIAKI·Filed 2009·Application pending·0 cites
- 1756US2008107517A1Semiconductor container opening/closing apparatus and semiconductor device manufacturing methodKOYAYASHI YOSHIAKI·Filed 2007·Application pending·0 cites
- 1854US10829416B2Rapid-hardening admixture and method for producing sameMITSUBISHI MATERIALS CORP·Filed 2017·Granted Nov 10, 2020·0 cites·6 claims
- 1954US8913760B2Sound reproducing device, reproduced sound adjustment method, acoustic characteristic adjustment device, acoustic characteristic adjustment method, and computer programJVC KENWOOD CORP·Filed 2013·Granted Dec 16, 2014·1 cites·15 claims
- 2047US6058856AWaste processing system and fuel reformer used in the waste processing systemHITACHI LTD·Filed 1998·Granted May 9, 2000·12 cites·5 claims
- 2147US4729521AController for winding unvulcanized rubber sheetMITSUBISHI HEAVY IND LTD·Filed 1986·Granted Mar 8, 1988·11 cites·2 claims
- 2246US6652212B2Cylinder, load port using it, and production systemCKD CORP·Filed 2001·Granted Nov 25, 2003·4 cites·12 claims
- 2344US6442938B2Waste processing system and fuel reformer used in the waste processing systemHITACHI LTD·Filed 2001·Granted Sep 3, 2002·1 cites·5 claims
- 2443US6282902B1Waste processing system and fuel reformer used in the waste processing systemHITACHI LTD·Filed 1999·Granted Sep 4, 2001·7 cites·6 claims
- 2540US4710255AApparatus for molding a belt for transmitting powerMITSUBISHI HEAVY IND LTD·Filed 1985·Granted Dec 1, 1987·9 cites·2 claims
- 2638US6958288B2Semiconductor device and manufacturing method thereofTRECENTI TECHNOLOGIES INC·Filed 2004·Granted Oct 25, 2005·0 cites·7 claims
- 2734US2002182037A1Substrate processing apparatus, substrate processing system, and substrate conveying methodSEMICONDUCTOR LEADING EDGE TEC·Filed 2002·Application pending·0 cites
- 2833US2006278612A1Manufacturing method of semiconductor integrated circuit deviceTOKUNAGA KENJI·Filed 2006·Application pending·0 cites
- 2929US4738736AMethod for molding a belt for transmitting powerMITSUBISHI HEAVY IND LTD·Filed 1986·Granted Apr 19, 1988·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →