Inventor · disambiguated record
Kenichi Tomioka
Also filed as: TOMIOKA KENICHI
7 granted patents·4 pending applications·35 citations·filing 1999–2020
80Inventor score
Files withHITACHI CHEMICAL CO LTD5SUZUKI MASAHIKO2MIZUNO YASUYUKI1SHOWA DENKO MATERIALS CO LTD1TAKEUCHI MASAKI1
Top patents by PatentIndex Score
11 records- 0178US7208539B2Thermosetting resin composition, and prepreg and laminated board using the sameHITACHI CHEMICAL CO LTD·Filed 2003·Granted Apr 24, 2007·15 cites·16 claims
- 0275US8956732B2Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring boardTAKEUCHI MASAKI·Filed 2007·Granted Feb 17, 2015·3 cites·14 claims
- 0368US7157506B2Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminateHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jan 2, 2007·7 cites·16 claims
- 0462US11691389B2Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin compositionSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Jul 4, 2023·0 cites·13 claims
- 0557US2007207326A1Resin composition excellent in dielectric properties, process for producing the same, varnish produced using the same, process for producing the varnish, and prepreg and metal-clad laminate using the resin composition and varnishMIZUNO YASUYUKI·Filed 2006·Application pending·0 cites
- 0654US2019161586A1Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin compositionHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 0751US6462147B1Epoxy resin compositions for printed circuit board and printed circuit board using the sameHITACHI CHEMICAL CO LTD·Filed 1999·Granted Oct 8, 2002·10 cites·13 claims
- 0851US2012244275A1Flexible laminate board, process for manufacture of the board, and flexible print wiring boardSUZUKI MASAHIKO·Filed 2012·Application pending·0 cites
- 0949US8501279B2Flexible laminate board, process for manufacturing of the board, and flexible print wiring boardSUZUKI MASAHIKO·Filed 2006·Granted Aug 6, 2013·0 cites·10 claims
- 1046US2006099391A1Thermosetting resin composition, and prepreg, metal-clad laminated board and printed wiring board using the sameTOMIOKA KENICHI·Filed 2005·Application pending·0 cites
- 1138US12258468B2Thermosetting resin composition, prepreg, resin-coated metal foil, laminate, printed wiring board, and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2019·Granted Mar 25, 2025·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →