Inventor · disambiguated record
Kenichi Tomitsuka
Also filed as: TOMITSUKA KENICHI
2 granted patents·5 pending applications·10 citations·filing 1992–2025
55Inventor score
Top patents by PatentIndex Score
7 records- 0176US2025256342A1Method of processing substrate using jet soldering apparatusSENJU METAL INDUSTRY CO·Filed 2025·Application pending·0 cites
- 0272US2023390846A1Jet soldering apparatusSENJU METAL INDUSTRY CO·Filed 2022·Application pending·0 cites
- 0362US2025339912A1Solder processing apparatusSENJU METAL INDUSTRY CO·Filed 2022·Application pending·0 cites
- 0451US2023112020A1Preform solder and bonding method using sameSENJU METAL INDUSTRY CO·Filed 2020·Application pending·0 cites
- 0543US6719144B2Method of separating oxide from dross, device for separating oxide from dross, and jet solder tankSONY CORP·Filed 2001·Granted Apr 13, 2004·4 cites·8 claims
- 0639US2022402057A1Magnetic-field melting solder, and joining method in which same is usedSENJU METAL INDUSTRY CO·Filed 2020·Application pending·0 cites
- 0733US5193734AJet solder bathSONY CORP·Filed 1992·Granted Mar 16, 1993·6 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →