Inventor · disambiguated record
Kenichi Tsuji
Also filed as: TSUJI KENICHI
15 granted patents·5 pending applications·93 citations·filing 1996–2023
90Inventor score
Top patents by PatentIndex Score
20 records- 0196US9481851B2Thermally-curable heat-conductive silicone grease compositionSHINETSU CHEMICAL CO·Filed 2013·Granted Nov 1, 2016·15 cites·16 claims
- 0288US12221543B2Thermally conductive silicone composition and production method thereforSHINETSU CHEMICAL CO·Filed 2020·Granted Feb 11, 2025·2 cites·6 claims
- 0388US8383005B2Thermally conductive silicone grease compositionSHINETSU CHEMICAL CO·Filed 2011·Granted Feb 26, 2013·11 cites·3 claims
- 0486US8802763B2Curable organopolysiloxane composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2012·Granted Aug 12, 2014·8 cites·7 claims
- 0577US9783723B2Thermal conductive silicone composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2016·Granted Oct 10, 2017·1 cites·13 claims
- 0670US2025129216A1Thermal conductive silicone compositionSHINETSU CHEMICAL CO·Filed 2023·Application pending·0 cites
- 0765US5965051ACeramic heating element made of molybdenum disilicide and silicon carbide whiskersFUJI ELECTRIC CO LTD·Filed 1996·Granted Oct 12, 1999·23 cites·30 claims
- 0861US9321950B2Thermally conductive silicone grease compositionTSUJI KENICHI·Filed 2012·Granted Apr 26, 2016·1 cites·10 claims
- 0953US6008479AMolybdenum disilicide ceramic composite infrared radiation source or heating sourceFUJI ELECTRIC CO LTD·Filed 1997·Granted Dec 28, 1999·16 cites·33 claims
- 1053US2024084182A1Thermally conductive silicone compositionSHINETSU CHEMICAL CO·Filed 2021·Application pending·0 cites
- 1149US9698077B2Heat conductive silicone composition based on combination of components, heat conductive layer, and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2013·Granted Jul 4, 2017·0 cites·9 claims
- 1246US11214651B2Thermally conductive silicone compositionSHINETSU CHEMICAL CO·Filed 2017·Granted Jan 4, 2022·0 cites·5 claims
- 1346US2024199817A1Curable organopolysiloxane composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2022·Application pending·0 cites
- 1445US12107031B2Thermal conductive silicone composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2019·Granted Oct 1, 2024·0 cites·5 claims
- 1544US10174237B2Thermal conductive silicone compositionSHINETSU CHEMICAL CO·Filed 2016·Granted Jan 8, 2019·0 cites·6 claims
- 1643US10844196B2Thermally-conductive silicone compositionSHINETSU CHEMICAL CO·Filed 2017·Granted Nov 24, 2020·0 cites·3 claims
- 1741US6158232AAdvanced liquid cooling apparatusNEC CORP·Filed 1999·Granted Dec 12, 2000·16 cites·10 claims
- 1839US11236203B2Thermal conductive silicone composition, semiconductor device, and method for manufacturing semiconductor deviceSHINETSU CHEMICAL CO·Filed 2017·Granted Feb 1, 2022·0 cites·25 claims
- 1935US2013105726A1Heat-conductive silicone compositionTSUJI KENICHI·Filed 2012·Application pending·0 cites
- 2032US2019002694A1Thermally conductive silicone composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →